Method for preparing composition of epoxy resin for packaging semiconductor

A technology of epoxy resin and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, chemical instruments and methods, etc., can solve the problems of affecting the performance of integrated circuits, reducing the yield, and unsatisfactory, achieving less air holes, Improve packaging yield and reduce the effect of wire punching

Inactive Publication Date: 2005-10-26
HENKEL HUAWEI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Viscosity has always been an important factor affecting the encapsulation performance of epoxy resin compositions. In the process of plastic encapsulation, the impact force of the encapsulant on the gold wire directly affects the performance of the integrated circuit. When the viscosity is high, the gold wire will be deformed. cause a short circuit, which reduces the yield
However, the existing preparation methods of epoxy resin compositions can no longer meet the requirements of producing epoxy resin compositions with low viscosity, high fluidity and less pores.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1. A preparation method for an epoxy resin composition for semiconductor encapsulation, the steps are as follows,

[0019] (1) Heat and mix the weighed epoxy resin and curing agent phenolic resin at 80 degrees Celsius in the reaction kettle, and stir evenly, then cool and pulverize to a powder whose particle size is less than 250um. 70% of the total amount of oxygen resin and phenol resin mixture;

[0020] (2) Surface-treat the weighed composite inorganic filler with a silane coupling agent in a high-speed mixer, and stir evenly;

[0021] (3) Mix the above epoxy resin and curing agent phenolic resin powder, pre-treated composite inorganic filler, and trace component curing accelerator, colorant, mold release agent, coupling agent and flame retardant in the mixer Stir at high speed to mix evenly;

[0022] (4) The mixture of step (3) is melted and kneaded through a through-hole twin-screw extruder, and the kneading temperature is set at 100 degrees Celsius, and...

Embodiment 2

[0023] Example 2. A preparation method for an epoxy resin composition for semiconductor encapsulation, the steps are as follows,

[0024] (1) Heat and mix the weighed epoxy resin and curing agent phenolic resin at 110 degrees Celsius in the reaction kettle, and stir evenly, then cool and pulverize to a powder whose particle size is less than 250um. 80% of the total amount of oxygen resin and phenol resin mixture;

[0025] (2) Surface-treat the weighed composite inorganic filler with a silane coupling agent in a high-speed mixer, and stir evenly;

[0026] (3) Mix the above epoxy resin and curing agent phenolic resin powder, pre-treated composite inorganic filler, and trace component curing accelerator, colorant, mold release agent, coupling agent and flame retardant in the mixer Stir at high speed to mix evenly;

[0027] (4) The mixture of step (3) is melted and kneaded through a through-hole twin-screw extruder, and the kneading temperature is set at 130 degrees Celsius, an...

Embodiment 3

[0029] Example 3. A preparation method for an epoxy resin composition for semiconductor encapsulation, the steps are as follows,

[0030] (1) Heat and mix the weighed epoxy resin and the curing agent phenolic resin at 90 degrees Celsius in the reaction kettle, and stir evenly, then cool and pulverize until the content of the powder with a particle size of less than 250um is about 100%. 75% of the total amount of oxygen resin and phenol resin mixture;

[0031] (2) Surface-treat the weighed composite inorganic filler with a silane coupling agent in a high-speed mixer, and stir evenly;

[0032] (3) Mix the above epoxy resin and curing agent phenolic resin powder, pre-treated composite inorganic filler, and trace component curing accelerator, colorant, mold release agent, coupling agent and flame retardant in the mixer Stir at high speed to mix evenly;

[0033] (4) The mixture of step (3) is melted and kneaded through a through-hole twin-screw extruder, and the kneading tempera...

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Abstract

The present invention relates to a preparation method of epoxy resin compound for semiconductor packaging process. Said epoxy resin compound has the advantages of low-viscosity, high-flowability, low water absorption and low porosity, etc. and can be used for packaging various integrated circuits and semiconductor devices.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin composition, in particular to a preparation method of an epoxy resin composition used for semiconductor encapsulation. Background technique [0002] With the rapid development of the semiconductor industry, the semiconductor packaging industry has also developed rapidly. As an epoxy resin composition for semiconductor packaging, it is widely used due to its low cost, good reliability and other advantages, accounting for more than 95% of semiconductor packaging materials. Under the ever-changing trend of electronic technology, integrated circuits are developing rapidly towards ultra-large-scale, ultra-high-speed, high-density, high-power, high-precision, and multi-functional directions. Therefore, epoxy resin compositions for integrated circuit packaging are also proposed. higher and higher requirements. Viscosity has always been an important factor affecting the encap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00
Inventor 成兴明韩江龙单玉来李兰侠谢广超张立忠孙波李云芝
Owner HENKEL HUAWEI ELECTRONICS
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