Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

An epoxy resin and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as deformation of flip-chip components, interface peeling, etc.
CN1696169AInactive Publication Date: 2005-11-16NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NITTO DENKO CORP
Publication Date
2005-11-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor excellent in fillability and void resistance, for example, in a flip chip package and capable of suppressing generation of warpage.
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Description

field of invention

[0001] The present invention relates to an epoxy resin composition for semiconductor sealing which is excellent in moldability and moisture resistance reliability in single-sided sealing type packages generally called ball grid array (BGA) packages and in packages called flip chip package types And a semiconductor device using the composition. Background technique

[0002] From the standpoint of protecting the external environment and that semiconductor elements can be attached and detached, semiconductor elements such as transistors, ICs, and LSIs are sealed by plastic packaging or the like to form semiconductor devices. Recently, along with the demand for thinner semiconductor devices and high-density packaging, there is a strong need to thin single-sided sealed packages such as BGA packages and to package and stack semiconductor elements in a stacked state.

[0003] As a sealing material excellent in fluidity and the like for such a BGA package, for ex...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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