Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

An epoxy resin and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as deformation of flip-chip components, interface peeling, etc.

Inactive Publication Date: 2005-11-16
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In addition, when the flip-chip module is sealed with resin by transfer molding using the above-mentioned sealing material, the following problems arise: (1) an unfilled portion is formed in the gap between the semiconductor element and the substrate, thereby creating a void; (2) ) In the moisture resistance reliability evaluation after molding, there will be interface peeling between the semiconductor element and the sealing resin and the interface peeling with the solder resist portion on the substrate; (3) Deformation of the flip chip module

Method used

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  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
  • Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～9

[0134] The components shown in the following Tables 1 to 3 were blended according to the ratios shown in the tables, and melted and kneaded for 3 minutes in a twin-roll kneader (temperature 100° C.). Next, after the molten material is cooled, it is pulverized to obtain a desired epoxy resin composition for encapsulating a semiconductor. And, "part" means a weight part.

[0135] Example

1

2

3

4

5

6

7

8

epoxy

resin

a

-

-

-

-

-

-

-

33

b

-

-

-

-

-

-

100

64

c

100

100

100

100

100

100

-

-

Phenolic

resin

a

108

108

108

108

108

108

119

-

b

-

-

-

-

-

-

-

50

c

-

-

-

-

-

-

...

Embodiment 17～32、 comparative example 10～23

[0152] The components shown in the following Tables 7 to 10 were blended according to the ratios shown in the tables, and melt-kneaded for 3 minutes in a twin-roll kneader (at a temperature of 100° C.). Next, after cooling this molten material, it pulverizes, and obtains the desired epoxy resin composition for semiconductor sealing. And, "part" means a weight part.

[0153] Example

17

18

19

20

21

22

23

24

epoxy

resin

a

100

100

100

80

70

80

100

100

d

-

-

-

20

30

-

-

-

c

-

-

-

-

-

20

-

-

Phenolic

resin

d

63

-

-

62

-

-

63

63

e

-

101

-

-

97

-

-

-

f

-

-

55

-

-

63

-

- ...

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Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor excellent in fillability and void resistance, for example, in a flip chip package and capable of suppressing generation of warpage.

Description

field of invention [0001] The present invention relates to an epoxy resin composition for semiconductor sealing which is excellent in moldability and moisture resistance reliability in single-sided sealing type packages generally called ball grid array (BGA) packages and in packages called flip chip package types And a semiconductor device using the composition. Background technique [0002] From the standpoint of protecting the external environment and that semiconductor elements can be attached and detached, semiconductor elements such as transistors, ICs, and LSIs are sealed by plastic packaging or the like to form semiconductor devices. Recently, along with the demand for thinner semiconductor devices and high-density packaging, there is a strong need to thin single-sided sealed packages such as BGA packages and to package and stack semiconductor elements in a stacked state. [0003] As a sealing material excellent in fluidity and the like for such a BGA package, for ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/00C08G59/62C08K9/06H01L23/29H01L23/31
CPCH01L24/97H01L2224/16225H01L2924/181
Inventor 秋月伸也丰田庆池村和弘石坂刚西冈务
Owner NITTO DENKO CORP
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