Mutual compensating metals-oxides-semiconductor structure and its mfg. method
A complementary metal and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, transistors, etc., can solve problems such as threshold voltage and flat-band voltage change
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example 1
[0062] In this example, a Hf oxide or silicate layer is first grown on a silicon wafer prefabricated with a field oxide pattern. The Hf oxides and silicates are deposited by metalorganic chemical vapor deposition (MOCVD) and atomic layer chemical vapor deposition (ALCVD). The thickness of Hf oxide and silicate layer is about 2-4nm, and the composition of silicate is close to Hf x Si y o 4 , where y / (x+y) is about 0.2-0.3. These oxides are deposited on n-type silicon wafers covered with silicon oxide or silicon oxynitride with a thickness of 0.3-1.2 nm. The presence of this layer is completely optional.
[0063] After depositing Hf oxide and silicate, the wafer is loaded into an ultra-high vacuum deposition chamber to deposit aluminum nitride. Aluminum nitride was deposited by evaporating Al from a resistively heated standard Al jet furnace and using a nitrogen beam from a commercial radio frequency atomic nitrogen source. The temperature of the spray furnace during depos...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com