Method for removing lattice defect in pad area of semiconductor device
A lattice defect, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, etc., can solve the problems of DRAM reliability impact, not particularly reliable, lattice defects in the pad area, etc.
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[0015] see below figure 2 and image 3 A method for cleaning and removing lattice defects in a pad (PAD) region of a semiconductor device with an organic solvent (EKC, ACT, etc.) according to the present invention will be described in detail. figure 2 It is a flow chart of the bonding pad formation process of the semiconductor device according to the present invention. image 3 It is a flow chart of organic solvent (EKC, ACT, etc.) cleaning treatment.
[0016] exist figure 2 The pad formation process flow of the semiconductor device according to the present invention is shown in figure 1 Step S1 (detecting whether there is a lattice defect in the pad area) is added between step 6 and step 7 of the pad formation process flow of the existing semiconductor device shown; and step S2 (when step S1 detects pad When there are lattice defects in the region, perform organic solvent (EKC, ACT, etc.) cleaning treatment). In step S1, use an optical microscope (OM) to detect whethe...
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