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Wood flooring composed of wpl, base and soundproof layer

A floor and substrate technology, applied in the field of laminated wood flooring, can solve problems such as not being able to meet various needs of users

Inactive Publication Date: 2006-02-15
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the conventional wood flooring causes complaints from users and cannot satisfy various needs of users

Method used

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  • Wood flooring composed of wpl, base and soundproof layer
  • Wood flooring composed of wpl, base and soundproof layer
  • Wood flooring composed of wpl, base and soundproof layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0043] 1. Preparation of polyvinyl chloride resin layer, particle board, high-density fiberboard and waterproof plywood layer 10

[0044] A polyvinyl chloride resin layer with a thickness of 1.0-5.0 mm is prepared from a composition comprising PVC resin, plasticizer, filler and stabilizer.

[0045] Particleboard and high-density fiberboard are produced by pressing in melamine resin shavings or fibers or fibrous wood obtained by cutting and subsequently shaping them. The waterproof plywood layer 10 is prepared by laminating 5 to 7 layers of veneers using melamine resin such that the grain directions of the veneers are perpendicular to each other and applying pressure thereto.

[0046] 2. Preparation of upper WPL20

[0047] 1) Preparation of UV coating 21

[0048] In terms of surface protection and high-quality appearance, UV coating is carried out 6 to 10 times. For coverings impregnated in amino resins (urea, melamine or urea-melamine resins), UV coating is carried out af...

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PUM

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Abstract

The present invention provides a lamination wood flooring having groove on the back, the WPL of the high pressure resin dipping lamination is laminated on the base selected from the PVC resin layer, oriented strand board(OSB), high density fibreboard (HDF) and waterproof glued board. In particular, the lamination wood flooring having groove on the back includes a WPL 20, an adhesive layer 40, and a base 10 (PVC resin layer, OSB, HDF or waterproof glued board), wherein the WPL 20 includes the base strengthening layer 24 separating by the following order, natural veneer layer 23, the covering layer 22 of the resin dipping and the surface UV coating 21. The lamination wood flooring having groove on the back further shows the excellent sound insulation value.

Description

technical field [0001] The present invention relates to a laminated wooden floor with grooves on the back for use in an underfloor heating system, wherein plywood of high-pressure resin-impregnated laminates (hereinafter referred to as "WPL") is laminated with resin layers selected from polyvinyl chloride, On substrates of oriented structural board (OSB), high density fiberboard (HDF) and waterproof plywood. More specifically, the present invention relates to a grooved-backed laminate wood floor for use in an underfloor heating system, comprising WPL, an adhesive layer, and a grooved-backed substrate, wherein the WPL comprises lamination from the bottom in the following order The substrate reinforcement layer (made of release paper, high-density fiberboard or kraft paper), resin-impregnated or unimpregnated natural veneer layer, resin-impregnated cover layer and surface UV coating, the substrate with grooves on the back is selected from polychlorinated The layers of vinyl, or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/30
CPCB32B7/12B32B21/04B32B21/06B32B29/06B32B2260/026B32B2260/028B32B2260/046B32B2419/04E04F15/041E04F15/10E04F15/206
Inventor 韩基善金秉会闵日泓郑炳鲁
Owner LG CHEM LTD
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