Wet treater

Abstract

To provide a wet treatment apparatus provided with a washing nozzle which is easy in the suction of a high viscosity fluid without using any ultrasonic wave, and has no left-over residue. A washing unit 11 arranged in the vicinity of a surface of a material to be washed 8, and having a supply port 2 with a slit discharge port 10 to discharge a fluid for cleaning 9 supplied from the outside in a belt shape on the surface of the material to be washed 8, and an outlet 3 discharging the fluid for cleaning 9 discharged from the discharge port 10 is provided. The washing unit where the cross-sectional area of the discharge port 10, the opening cross-sectional area of a tip portion to discharge the fluid for cleaning 9 toward the surface of the material to be washed 8, to the opening cross-sectional area of a supply port socket portion of the fluid for cleaning 9 supplied from the outside is one time a positive number exceeding one is arranged in a direction perpendicular to the moving direction of the material to be washed 8.

Description

technical field [0001] The present invention relates to a wet processing apparatus having a cleaning unit for cleaning the surfaces of semiconductor wafers and glass substrates. Background technique [0002] In the manufacture of electronic equipment such as semiconductor equipment, semiconductor devices, and liquid crystal display panels, the process of cleaning semiconductor wafers and glass substrates as objects to be cleaned must be included in the manufacturing process. In the cleaning process, in order to remove various substances to be removed in the manufacturing process, various cleaning liquids such as ultrapure water, electrolytic ionized water, ozone water, and hydrogen water are used for cleaning. These cleaning liquids are supplied from the nozzle of the cleaning device to the on the substrate. [0003] However, for a wet processing device that currently uses a general cleaning nozzle, for example, a cleaning solution such as electrolytic ionized water is used...

AI Technical Summary

Problems solved by technology

[0003] However, for a wet processing device that currently uses a general cleaning nozzle, for example, a cleaning solution such as electrolytic ionized water is used to clean a 500 mm square substrate. The remaining amount of foreign matter (particles) on the substrate after rinsing is expected to reach 0.5 particles / cm 2 If the level of cleanliness is high, you must use about 25-30 liters / min of cleaning fluid and flushing cleaning fluid.

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