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Phototonus thermosetting resin composition and printing plug board coating with resist and its manufacturing method

A resin composition, thermosetting technology, applied in the photoengraving process of pattern surface, photosensitive materials for opto-mechanical equipment, optics, etc. Problems such as insufficient flexibility

Active Publication Date: 2010-05-05
SANEI KAGAKU KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, the resist obtained from the photopolymerizable thermosetting resin composition of Patent Document 6 is the same as the above-mentioned Patent Documents 1 to 5 in terms of coating film transparency, HAST resistance (particularly HAST resistance in electrical insulation), resistance to Insufficient thermal shock resistance and coating film bending resistance

Method used

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  • Phototonus thermosetting resin composition and printing plug board coating with resist and its manufacturing method
  • Phototonus thermosetting resin composition and printing plug board coating with resist and its manufacturing method
  • Phototonus thermosetting resin composition and printing plug board coating with resist and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0308]

Synthetic example 1

[0309] Synthesis example 1: the synthesis of epoxy resin (Chemical I / E-1-1)

[0310] The raw material bisphenol A type epoxy resin [h shown in the following formula 11 The average value (ie average degree of polymerization) 3.3, epoxy equivalent 650, softening point 81.1 ℃, melt viscosity (150 ℃) 12.5 poise] 371 parts by weight, epichlorohydrin 925 parts by weight and dimethyl sulfoxide 462.5 parts by weight are uniform dissolve. Then, 52.8 parts by weight of 98.5% NaOH was added to this homogeneous solution over 100 minutes at 70° C. with stirring.

[0311]

[0312] [where, h 11 Indicates the degree of polymerization].

[0313] After the addition, the reaction was further performed at 70° C. for 3 hours. Then, most of the excess unreacted epichlorohydrin and dimethyl sulfoxide were distilled off under reduced pressure. Then, after dissolving the reaction product containing byproduct salts and dimethyl sulfoxide in 750 parts by weight of methyl isobutyl ketone, 10 part...

Synthetic example 2

[0316] Synthesis Example 2: Synthesis of Epoxy Resin (Chem. I / E-1-2)

[0317] The raw material bisphenol F type solid epoxy resin [h shown in the following formula 21 The average value of 5.8, epoxy equivalent 800, softening point 79 ° C] 400 parts by weight, 925 parts by weight of epichlorohydrin and 462.5 parts by weight of dimethyl sulfoxide were uniformly dissolved. Then, 81.2 parts by weight of 98.5% NaOH was added to this homogeneous solution over 100 minutes at 70° C. with stirring.

[0318]

[0319] [where, h 21 Indicates the degree of polymerization].

[0320] After the addition, the reaction was further performed at 70° C. for 3 hours. Then, most of the excess unreacted epichlorohydrin and dimethyl sulfoxide were distilled off under reduced pressure. Then, after dissolving the reaction product containing byproduct salts and dimethyl sulfoxide in 750 parts by weight of methyl isobutyl ketone, 10 parts by weight of a 30% NaOH aqueous solution was added and react...

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PUM

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Abstract

To provide a photosensitive thermosetting resin composition which has excellent storage stability and can give resists having excellent developability, set dryness to contact, flexural resistance, adhesiveness, coating film transparency, HAST (highly accelerated temperature and humidity stress test) resistance (especially HAST resistance in electric insulating property), heat shock resistance, andthe like, to provide a smoothed printed circuit board having excellent resist, and to provide a method for producing the same. This photosensitive thermosetting resin composition is characterized bycomprising an unsaturated group-containing polycarboxylic acid resin [I], a diluent [II], a photopolymerization initiator [IV], a crystalline epoxy resin [V] represented by formula (V), and a hardening adhesiveness-imparting agent [VI].

Description

technical field [0001] The present invention relates to a photosensitive thermosetting resin composition useful for resist printing materials (especially solder resist printing materials) and printed wiring boards coated with resists (especially smoothed printed wiring boards coated with solder resists) Wire board, etc.) and its manufacturing method. technical background [0002] As a resist resin or printing material composition for photosensitive printed wiring boards, it is known to use a polycarboxylic acid (acid anhydride) containing an unsaturated group obtained by reacting a reaction product of an epoxy resin and (meth)acrylic acid having a specific structure. Agglomerated polycarboxylic acid resins are used as active energy ray curable resins. [0003] For example, Patent Documents 1 to 3 describe polycarboxylic acid resins containing unsaturated groups of specific structures, diluents [trimethylolpropane tri(meth)acrylate, 2-hydroxyethyl(methyl) Acrylate, etc.], p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/032
Inventor 佐藤清久能敏光古闲幸博畔柳安宏臼井幸弘
Owner SANEI KAGAKU KK