Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for molding and film coating powder of cupric iodide

A copper iodide and film coating technology, applied in chemical instruments and methods, methods of granulating raw materials, copper halide, etc., can solve the problem of small gas-solid contact area, difficult to carry out the reaction continuously and stably, impurity of the target product, etc. problems, to achieve the effect of ensuring purity and quality

Inactive Publication Date: 2006-04-19
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first reason is that the resistance of the powder solid bed is large, the gas-solid contact area is small, and the reaction is difficult to continue and stably; the second is that the gas will blow up the copper iodide solid powder and bring it into the rear system, so that the gas-solid reaction gas product Mixed with solid impurities, resulting in the impurity of the target product, which cannot be applied in practice

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] (1) Put 12 milliliters of copper iodide powder into the sugar-coating pan, turn the sugar-coating pan, and spray 6 milliliters of 0.01% forming agent polyvinyl alcohol aqueous solution evenly into the powder in the pot, so that the materials in the pot gradually Form small solid particles, continue to add evenly into the pot according to the ratio of 2 milliliters of copper iodide powder to 1 milliliter of forming agent, until the small particles grow to the pellets of the required particle size, take out the solid copper iodide pellets from the pot, Vacuum dry in a vacuum oven for 6 hours. Complete the copper iodide molding preparation.

[0019] (2) Weigh 5 grams of dry polyvinylidene fluoride (PVDF), put it into 95 grams of N-methylpyrrolidone, add 2 grams of polyethylene glycol 2000, 20 grams of sodium chloride, and dissolve it under vacuum at 50°C After 2 hours, degassing to make a uniform casting solution.

[0020] (3) After taking 100 milliliters of formed coppe...

Embodiment 2

[0023] (1) Put 18 ml of copper iodide powder into the sugar-coating pan, turn the sugar-coating pan, and spray 6 ml of polyvinyl alcohol aqueous solution of forming agent with a concentration of 1‰ evenly into the powder in the pot, so that the materials in the pot gradually Form solid small particles, continue to add evenly into the pot according to the ratio of 3 milliliters of copper iodide powder to 1 milliliter of forming agent, until the small particles grow to the pellets of the required particle size, take out the solid copper iodide pellets from the pot, Vacuum dry in a vacuum oven for 6 hours. Complete the copper iodide molding preparation.

[0024] (2) Weigh 7 grams of dry polyvinylidene fluoride (PVDF), put 93 grams of dimethylacetamide, then add 5 grams of polyethylene glycol 2000, 10 grams of sodium chloride, and dissolve it under vacuum at 50 ° C for 2 Hours, defoaming, to make a uniform casting solution.

[0025] (3) After taking 100 ml of formed copper iodid...

Embodiment 3

[0028] (1) Put 30 milliliters of copper iodide powder into the sugar-coating pan, turn the sugar-coating pan, and spray 6 milliliters of 5% forming agent polyvinyl alcohol aqueous solution evenly into the powder in the pot, so that the materials in the pot gradually Form small solid particles, continue to add evenly into the pot according to the ratio of 5 ml of copper iodide powder to 1 ml of forming agent, until the small particles grow to the required particle size balls, take the solid copper iodide balls out of the pot, and place them in a vacuum Vacuum dry in oven for 6 hours. Complete the copper iodide molding preparation.

[0029] (2) Weigh 3 grams of dry polyvinylidene fluoride (PVDF), put it into 97 grams of N-methylpyrrolidone, then add 5 grams of polyethylene glycol 2000, 45 grams of sodium chloride, and dissolve it under vacuum at 50°C After 2 hours, degassing to make a uniform casting solution.

[0030] (3) After taking 100 milliliters of formed copper iodide 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A process for shaping the copper iodide particles and coating them includes such steps as loading the irregular copper iodide particles in a container, proportionally adding shaping agent, spheroidizing by making the container to rotate, drying, adding it to the filming liquid containing pore-forming agent, coating by phase change method, and vacuum drying at 50-60 deg.C for 1-2 hr, at 70-80 deg.C for 1-2 hr and at 100-120 deg.C for 2-4 hr.

Description

technical field [0001] The invention relates to a copper iodide molding and film coating method, in particular to a method for making irregular crystal powder copper iodide into regular and uniform particles and performing film coating treatment on the spherical particles. Background technique [0002] Copper iodide is off-white irregular solid powder. It is not feasible to realize the gas-solid phase reaction in contact with gas in a fixed-bed reactor equipped with copper iodide powder. The first reason is that the resistance of the powder solid bed is large, the gas-solid contact area is small, and the reaction is difficult to continue and stably; the second is that the gas will blow up the copper iodide solid powder and bring it into the rear system, so that the gas-solid reaction gas product Mixed with solid impurities, the resulting target product is impure and cannot be used in practice. Contents of the invention [0003] The object of the present invention is to p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B01J2/00C01G3/04
Inventor 张朋王树东袁权吴迪镛
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI