Heat radiation assembly and its flow direction control structure

A technology for heat dissipation components and flow direction control, which is applied in the field of heat dissipation components and their flow direction control structures, and can solve the problems that heat energy cannot be dissipated well, the area of ​​the air outlet is reduced, and heat cannot be effectively dissipated.
CN1767182AInactive Publication Date: 2006-05-03DELTA ELECTRONICS INC
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
DELTA ELECTRONICS INC
Publication Date
2006-05-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a radiating component which at least comprises a first radiator, a second radiator and a flow direction controller. The first radiator and the second radiator are symmetry positioned; the flow direction controller structure comprises a plurality of movable units between the first radiator and the second radiator; each movable unit has a fixed first end and a corresponding movable second end used to separately lead the air flow direction of the first radiator and the second radiator. The bisect of the movable unit can be bar form, limb form, arc form or other non-linear forms; it has non-equal thickness or reducing thickness from the first end to the second end; each movable unit is overlap with the adjacent movable unit used to choosing seal the radiator.
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Description

technical field

[0001] The present invention relates to a cooling component and its flow direction control structure, and in particular to a cooling component with a low-noise flow control structure capable of controlling the flow direction of the airflow. Background technique

[0002] With the continuous improvement of the performance of electronic devices, the heat sink has become one of the indispensable equipment in the current electronic devices, because if the heat energy generated by the electronic devices cannot be dissipated properly in real time, it will cause the performance of the electronic devices to deteriorate. It may cause burning of the electronic device. The heat dissipation device is even more important for microelectronic components (such as integrated circuits, integrated circuits), because with the increase of integration and the improvement of packaging technology, the area of ​​integrated circuits is continuously reduced, and the accumulated per unit...

Claims

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