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Surface treating method for wiring board and method for manufacturing electrical device

A surface treatment and circuit board technology, which is applied in printed circuit manufacturing, printed circuit secondary treatment, printed circuit, etc., can solve problems such as disconnection of wiring parts, and achieve high connection reliability.

Active Publication Date: 2011-08-03
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, if copper nitrate is formed on a wiring portion consisting of a narrow portion of metal wiring, the wiring portion may be disconnected.

Method used

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  • Surface treating method for wiring board and method for manufacturing electrical device
  • Surface treating method for wiring board and method for manufacturing electrical device
  • Surface treating method for wiring board and method for manufacturing electrical device

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Experimental program
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Effect test

Embodiment Construction

[0028] Embodiments of the present invention will be described below with reference to the drawings. figure 1 Reference numeral 11 in (a) denotes a base material made of a long resin film, and a metal wiring layer 14 made of a metal thin film is formed on the surface of the base material 11 .

[0029] First, in order to produce a circuit board, a resist coating solution containing a photosensitive resin is applied on the surface of the metal wiring layer 14 and heated to form a protective layer made of resin, which is then exposed and developed using a mask. The protective layer is patterned into a prescribed planar shape.

[0030] Since the base material 11 is longer than the mask, the area exposed by one exposure is limited. When the exposure and development are repeated using a mask, the entire protective layer is exposed and developed, and a protective layer having the same pattern in each predetermined region is formed on the metal wiring layer 14 .

[0031] figure 1 Re...

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PUM

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Abstract

Disclosed is a surface treating method wherein the surface of a base (11) exposed between multilayer films (13) is processed with a plasma (28) while a patterned metal wiring layer (15) is not exposed to the plasma (28) since a wiring board (10) is exposed to the plasma (28) with the patterned metal wiring layer (15) covered with a protective layer (18). Consequently, in cases where the metal wiring layer (15) is composed of copper, a copper nitrate is not formed on the surface of the metal wiring layer (15) even when the atmosphere comes into the space where the plasma is generated. The metal wiring layer (15) is thus prevented from deterioration, and a highly reliable electrical device can be obtained by connecting a wiring board (10) treated by such a surface treating method to an electrical component.

Description

technical field [0001] The invention relates to a technology for mounting electrical components on a circuit board, in particular to a surface treatment technology for a circuit board. Background technique [0002] Conventionally, before mounting a semiconductor element on a circuit board such as a flexible circuit board via an adhesive, surface treatment is performed to improve the affinity between the circuit board and the adhesive. [0003] In the conventional surface treatment method, a circuit board is placed in a vacuum chamber, plasma is generated by glow discharge in a state where a vacuum environment is formed in the vacuum chamber, and the surface treatment is performed using the plasma. However, in the conventional glow discharge method, not only the manufacturing cost of the processing apparatus is high, but also the working time is prolonged because of the need to evacuate the processing chamber. [0004] As a surface treatment method by plasma, there is a meth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38H05K3/26H05K3/32H05H1/24
CPCH05K2203/095H05K2201/0761H05K3/26
Inventor 宇贺神胜
Owner DEXERIALS CORP