Printed wiring board, its manufacturing method, and circuit device
A printed circuit board and manufacturing method technology, applied in the fields of printed circuit boards, manufacturing and circuit devices, can solve problems such as deterioration of electrical insulation performance, and achieve the effects of preventing changes in electrical impedance and stabilizing electrical impedance for a long time
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Embodiment 1
[0075] A polyimide film (UPILEX S, manufactured by UBE INDUSTRIES, LTD.) having an average thickness of 50 μm was roughened on one surface by reverse sputtering. Subsequently, under the following conditions, a nickel-chromium alloy layer was sprayed with an average thickness of 40 nm to prepare a base metal layer.
[0076] Sputtering conditions are as follows: 50 μm thick polyimide film at 100 ° C and 3 × 10 -5 Pa was treated for 10 minutes, followed by degassing, and chromium-nickel alloy was sprayed at 100°C and 0.5Pa.
[0077] On the base metal layer, copper was sputtered at 100° C. and 0.5 Pa to an average thickness of 300 nm.
[0078] The sprayed copper layer was electroplated with copper, and an electrolytic copper layer (electroplated copper layer) having a thickness of 8 μm was formed.
[0079] The copper layer (conductive metal layer) was coated with a photosensitive resin, and the resin was exposed and developed to produce a comb-shaped wiring pattern with a line p...
Embodiment 2
[0086] A polyimide film (UPILEX S, manufactured by UBE INDUSTRIES, LTD.) having an average thickness of 50 μm was roughened on one surface by reverse sputtering. Subsequently, a nickel-chromium alloy layer was sprayed with an average thickness of 40 nm under the following conditions to prepare a base metal layer.
[0087] Sputtering conditions are as follows: 50 μm thick polyimide film at 100 ° C and 3 × 10 -5 It was treated at Pa for 10 minutes, followed by degassing, and chromium-nickel alloy was sprayed at 100° C. and 0.5 Pa.
[0088] The base metal layer sprayed as described above was plated with copper, and a conductive metal layer (copper plated layer) having a thickness of 8 μm was formed.
[0089] The conductive metal layer was coated with a photosensitive resin, and the resin was exposed and developed to produce a comb-shaped wiring pattern with a line pitch of 30 μm (line width 15 μm, space width 15 μm). The wiring pattern was used as a mask, and then the copper la...
Embodiment 3
[0095] A polyimide film (UPILEX S, manufactured by UBE INDUSTRIES, LTD.) having an average thickness of 75 μm was roughened on one surface by reverse sputtering. Subsequently, a nickel-chromium alloy layer was sprayed with an average thickness of 30 nm under the same conditions as in Example 1 to prepare a base metal layer.
[0096] On the base metal layer, copper was sputtered with an average thickness of 200 nm under the conditions described in Example 1.
[0097] The sprayed copper layer was electroplated with copper, and a conductive metal layer of electrolytic copper having a thickness of 8 μm was formed.
[0098] The conductive metal layer was coated with a photosensitive resin, and the resin was exposed and developed to produce a comb-shaped wiring pattern with a line pitch of 30 μm (line width 15 μm, space width 15 μm). The wiring pattern was used as a mask, and the conductive metal layer was etched for 30 seconds with a 12% copper chloride etching solution containing...
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