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Light-emitting device

A technology for light-emitting devices and light-emitting diodes, which is applied to electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as troublesome filling steps, and achieve the effect of reducing temperature

Active Publication Date: 2006-06-28
MATSUSHITA ELECTRIC WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the filling step is cumbersome

Method used

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Examples

Experimental program
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Embodiment Construction

[0093] Light emitting devices of several embodiments of the present invention are explained below with reference to the accompanying drawings, wherein like reference characters denote like or corresponding parts throughout the several views.

[0094] figure 2 A light emitting device 200 of an embodiment of the present invention is shown. In the light emitting device 200 , the bottom 11 of the submount 100 for LEDs is in thermal contact with the metal plate 30 of the circuit board 300 . The submount 100 has a mounting base 10 having wires 12-14 and 13-17, and a light emitting diode (LED) chip 5 mounted on the mounting base 10. LED wafer 5 is shown along perpendicular to its figure 2 The orientation of the paper is issued for the harness. The circuit board 300 has a metal plate 30 and a metal pattern 41 for an electrical conductor formed on an electrical insulating layer 40 . The LED chip 5 has a gallium nitride semiconductor. In this embodiment and the following embodime...

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Abstract

A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

Description

technical field [0001] The invention relates to a light-emitting device with a light-emitting diode, in particular to a light-emitting device with good heat transfer performance. Background technique [0002] Recently, light-emitting diode (LED) chips that emit blue or ultraviolet light based on GaN semiconductors are combined with various types of fluorescent materials to emit light of one or more colors (including white light) different from the light emitted by LED chips. Light emitting devices have been developed. The light emitting device, for example, has the advantages of small size, light weight, and low power consumption, and is widely used as a light source for displays, a light source for replacing small bulbs, a light source for liquid crystal displays, and the like. When such a light emitting device is used for a light source of a display, a light source of a liquid crystal panel, or the like, the luminance per wafer is low and insufficient. LED packages are t...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/64
CPCH01L2924/12041H01L2224/48091H01L2224/48465H01L2224/16H01L2924/19107H01L2924/00011
Inventor 桥本拓磨杉本胜横谷良二西冈浩二岩堀裕石崎真也铃木俊之内野野良幸武藤正英森哲木村秀吉
Owner MATSUSHITA ELECTRIC WORKS LTD
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