Heat-conductive characteristic detecting device and detecting method

Abstract

A heat conduction performance detection device includes one heating portion, one bearing portion, said bearing portion including one supporting block and first heat conduction block integrated moulded with said support block, said first heat conduction block further including one loaded plane, one buckle portion including heat conduction block, said second heat conduction block further including one buckle plane corresponded with above-mentioned loaded plane, and plurality of buckle, wherein said heating portion providing bearing portion one constant temperature, two ends of said buckle respectively fastening first heat conduction block and second heat conduction block, said second heat conduction block further including one temperature measuring unit for measuring second heat conduction block temperature.

Description

【Technical field】 [0001] The invention relates to a thermal conductivity detection device and a detection method, in particular to a thermal conductivity detection device and a detection method of a thermal interface material. 【Background technique】 [0002] With the continuous improvement and development of semiconductor integrated circuits, the degree of circuit integration is getting higher and higher, and the application of Thermal Interface Material (TIM) is becoming more and more extensive. However, the most fundamental parameter that determines the performance of thermal interface materials is thermal conductivity. In the development process of thermal interface materials, the experimental measurement of its thermal conductivity is an indispensable and important step. After each thermal interface material with different formulations is formulated, the thermal resistance value will be experimentally measured to determine whether it meets the requirements. . Therefore...

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Problems solved by technology

However, although the thermal conductivity measuring device and method can obtain a more accurate thermal conductivity value through measurement, the measurement steps are complicated and the installation is not easy. In order to obtain the precise temperature difference between the two ends of the thermal interface material, multiple temperature measurement holes must be set up.

Moreover, the measurement must wait until the entire system reaches thermal equilibrium, and the measurement speed is slow, which is not conducive to the rapid screening of a large number of thermal interface material samples

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