Photosensitive resin composition, its condensate and display panel used interval element formed therewith
A technology of photosensitive resin and composition, applied in the field of spacer for display panel and photosensitive resin composition, can solve the problems of difficulty in taking into account the characteristics of cured product and workability, the problem of storage stability, and the reduction of workability, etc. Excellent storage stability, sufficient heat resistance, and the effect of reducing waste
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[0088] Hereafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples. In addition, in the following, "part" means a mass part unless otherwise indicated.
[0089] Preparation of Photosensitive Resin Solution Containing Carboxyl Group
Synthetic example 1
[0091] Into a detachable flask equipped with a stirrer, a reflux condenser, and a thermometer, 4.1 parts of azobisisobutyronitrile and 286 g of propylene glycol monomethyl ether acetate were added, and the mixture was heated in a hot water bath so that the inner temperature became 70°C. A mixture of 124.5 parts of dicyclopentyl methacrylate represented by the general formula (1), 10.4 parts of styrene, and 58.9 parts of glycidyl methacrylate was dripped there over 3 hours to perform a polymerization reaction. It was further stirred at 70° C. for 3 hours, and it was confirmed by GPC that there was no unreacted monomer. To this polymer, 31.2 parts of acrylic acid and 1 part of triphenylphosphine were added, and reacted at 80-90° C. for 24 hours. After confirming the disappearance of the epoxy group by IR spectrum, 60.9 parts of tetrahydrophthalic anhydride was added, and it was made to react at 80 degreeC for 12 more hours, and obtained the carboxyl group containing photosensiti...
Synthetic example 1
[0093] Into a detachable flask equipped with a stirrer, a reflux condenser, and a thermometer, 4.1 parts of azobisisobutyronitrile and 125 g of propylene glycol monomethyl ether acetate were added, and the mixture was heated in a hot water bath so that the inner temperature became 70°C. A mixture of 55 parts of methyl methacrylate, 20.8 parts of styrene, and 42.7 parts of glycidyl methacrylate was added dropwise thereto for 3 hours to perform a polymerization reaction. It was further stirred at 70° C. for 3 hours, and it was confirmed by GPC that there was no unreacted monomer. In this polymer, 23.4 parts of acrylic acid and 0.8 part of triphenylphosphine were added and reacted at 80-90°C for 16 hours. After confirming the disappearance of the epoxy group by IR spectrum, add 45.7 parts of tetrahydrophthalic anhydride and react at 80°C for another 8 hours to obtain a carboxyl-containing photosensitive resin that does not contain the compound represented by the general formula (...
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Abstract
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