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Packaging method and system of electric component

A technology of electrical components and installation methods, applied in the direction of electrical components, electrical components, and printed circuits assembled with electrical components, can solve the problems of low, unable to fully ensure the reliability of initial on-resistance connection, insufficient heating connection reliability, etc., achieve the effect of preventing voids

Active Publication Date: 2006-08-23
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the case of the method of pressurizing and heating using such a crimping head such as a metal, there is also the following problem: when thermocompression bonding is performed, the swelling part of the adhesive around the IC chip is not heated enough to cause a connection problem. Reliability is low, and mounting of multiple IC chips is also difficult
[0008] However, in such prior art, there is a problem that sufficient connection cannot be made due to insufficient pressure between the bump portion and the pattern as the connection portion between the IC chip and the substrate, and the initial on-resistance cannot be sufficiently ensured. and connection reliability after aging

Method used

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  • Packaging method and system of electric component
  • Packaging method and system of electric component
  • Packaging method and system of electric component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] As a wiring substrate, a copper (Cu) pattern with a width of 75 μm and a pitch of 150 μm is formed on a glass fiber reinforced plastic substrate, and a rigid substrate with nickel-gold plating is used on it. As an IC chip, bump electrodes formed with a pitch of 150 μm are prepared. 6×6mm chip with a thickness of 0.4mm.

[0084] Furthermore, a thermocompression joint equipped with a crimping part made of silicone rubber with a size of 60 x 60 mm, a thickness of 10 mm, and a rubber hardness of 40 was used as an anisotropic conductive adhesive film at a melt viscosity of 1.0 x 10 5 A thin film in which conductive particles are dispersed in mPa·s adhesive resin, and the IC chip is bonded to the wiring board by thermocompression.

[0085] In this case, the temperature of the base is controlled so that the temperature of the crimping part is 100°C, the temperature of the anisotropic conductive adhesive film is 200°C, and the pressure is 100N / IC (278N / cm 2 ) Pressurize and he...

Embodiment 2

[0087] Thermocompression bonding was performed under the same conditions as in Example 1 except that the crimping portion made of silicone rubber with a rubber hardness of 80 was used.

Embodiment 3

[0093] Except for use in melt viscosities of 1.0 x 10 5 Except for the anisotropic conductive adhesive film in which conductive particles were dispersed in the mPa·s adhesive resin, thermocompression bonding was performed under the same conditions as in Example 1.

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Abstract

A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The present invention is a mounting method including the step of thermocompression bonding an IC chip 20 onto a wiring board 10 by using an anisotropic conductive adhesive film 7. During the thermocompression bonding, a top region of the IC chip 20 is pressed against the wiring board 10 with a predetermined pressure, and a side region of the IC chip 20 is pressed with a pressure smaller than the pressure applied to the top region of the IC chip 20. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion 6 of a thermocompression bonding head 4. The anisotropic conductive adhesive film 7 contains a binding resin 7b having melting viscosity of 1.0 x 10 2 mPa · s or more and 1.0 x 10 5 mPa·s or less.

Description

technical field [0001] The present invention relates to a technique of mounting electrical components such as semiconductor chips on a wiring substrate, and particularly relates to a technique of mounting electrical components using an adhesive. Background technique [0002] Conventionally, as a method of directly mounting a bare chip on a wiring board such as a printed circuit board, a method using an anisotropic conductive adhesive film in which conductive particles are dispersed in an adhesive is known. [0003] In the mounting method using an anisotropic conductive adhesive film, after the IC chip is mounted on the substrate on which the anisotropic conductive adhesive film is pasted, the IC chip is pressed with a flat crimping head made of ceramics or metal. Heat to cure the anisotropic conductive adhesive film for thermocompression mounting. [0004] In the case of the method of pressurizing and heating using such a crimping head such as a metal,...

Claims

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Application Information

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IPC IPC(8): H01L21/60H05K3/32
CPCH01L2224/75252H01L2224/83855H01L24/83H01L2924/0781H01L2924/01002H01L24/29H01L2224/2929H01L2224/83101H01L2224/32225H05K3/323H01L2224/16H01L2924/01015H01L2924/00013H01L2224/16225H01L2924/01004H01L2924/01006H01L2924/01078H01L2924/01079H01L2224/29298H01L2924/14H01L2924/01005H01L2224/29299H01L2224/73204H01L2224/2919H01L2224/75251H01L2924/014H01L2924/07811H01L2924/01029B30B5/02B30B15/065H01L2924/01033H01L2924/0665H01L2224/75315H01L24/75H01L2224/7598H01L2924/00H01L2924/00014H01L2224/29099H01L2224/29199H05K13/04H05K3/32
Inventor 松村孝安藤尚蟹泽士行须贺保博工藤宪明
Owner DEXERIALS CORP
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