Wafer heat radiation system and its heat radiator structure and manufacturing method
A technology of heat dissipation system and heat dissipation device, which is used in instruments, electrical digital data processing, electrical components, etc., can solve problems such as poor heat dissipation efficiency of thermally conductive materials, and achieve the effect of improving competitiveness, good quality, and quality improvement.
Inactive Publication Date: 2006-10-11
GETAC TECH CORP
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Problems solved by technology
[0012] In this way, a thermally conductive material is developed, which contains a metal material and a carbon element with a frame structure (such as a diamond material) to greatly increase its thermal conductivity to meet the poor heat dissipation efficiency of existing thermally conductive materials. The problem is that the users of integrated circuit application products are eagerly looking forward to it and the inventor is thinking about it, and the inventor is based on many years of research and development of heat dissipation systems and heat-conducting materials and many practical experiences, thinking and improving ideas, Lacking his personal professional knowledge, and after many studies and designs and special discussions, he has proposed a structure and manufacturing method of a chip heat dissipation system and its heat dissipation device as a solution and basis for the above problems
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[0025] see Figure 4, which is a schematic diagram of a chip heat dissipation system 3 according to the present invention, including a chip 31 , a substrate 32 , a heat dissipation device 33 , a heat exchange device 34 and a pumping device 35 . Wherein the chip 31 can be a central processing unit chip and further includes a plurality of pin angles 311 for connecting the chip 31 to a substrate 32, and the substrate 32 can be an existing motherboard and a display card. In addition, the heat dissipation device 33 can be closely attached to the upper edge of the chip 31 by coating the heat dissipation paste 331 . The pumping device 35, the cooling device 33 and the heat exchanging device 34 can be connected to each other by a conduit 351, wherein the pumping device 35 can transfer a fluid (not shown in the figure) with a high specific heat coefficient to the cooling device via the conduit 351 33 and heat exchange device 34 circulation flow. Then the heat sink 33 is made of a the...
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The disclosed wafer cooling system receives the waste heat of wafer and comprises a cooling device, a heat exchange device to the release waste heat, a pumping device to drive the fluid flowing in the cooling device and the exchange device, and at least two pipes for linkage. Wherein, the device is made of a heat-conducting material included metal material and backbone-structure carbon with high thermal conductive coefficient prepared by CVD, PVD, fusion or other method.
Description
【Technical field】 [0001] The present invention relates to the structure and manufacturing method of a chip heat dissipation system and its heat dissipation device, especially the heat dissipation device is composed of a heat conduction material including a metal material and a carbon element with a frame structure. 【Background technique】 [0002] The application of large-scale integrated circuits based on semiconductor manufacturing processes has been widely accepted by the public in recent years, such as personal computers, network servers, dynamic random access memories, various driver integrated circuits, and smart home appliances, etc. Because the number of ethnic groups is too large to be included, so I won’t go into details here; this has further promoted the rapid growth and prosperity of the semiconductor industry. The government even implemented an economic development plan for two trillion double-star key industries, which includes the cultivation and development of...
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IPC IPC(8): H01L23/34G06F1/20H01L23/36H01L23/46
Inventor 黄明汉郑裕强陈兆逸郭欣陇李秉蔚萧惟中李秉峰
Owner GETAC TECH CORP