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Resin compositions and methods of use thereof

一种组合物、混合物的技术,应用在化学仪器和方法、运输和包装、分层产品等方向,能够解决芯片移动、芯片未对准、未对准等问题

Inactive Publication Date: 2007-02-21
MOMENTIVE PERFORMANCE MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Furthermore, the problem with applying underfill resins at the chip stage is chip misalignment, which can occur after the chip has been displaced on the substrate
Without means to hold the chip in place on the substrate or device, the chip will move and become misaligned during the reflow soldering operation

Method used

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  • Resin compositions and methods of use thereof
  • Resin compositions and methods of use thereof
  • Resin compositions and methods of use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] A functionalized colloidal silica (FCS) pre-dispersion was prepared. A functionalized colloidal silica pre-dispersion was prepared by combining the following steps: 935 g of isopropanol (Aldrich) was slowly added with stirring to 675 g of 34 wt %, 20 nm SiO 2 Granular hydrous colloidal silica (Nalco 1034A, Nalco Chemical Company). Subsequently, 58.5 g of phenyltrimethoxysilane (PTS) (Aldrich) dissolved in 100 g of isopropanol were added to the stirred mixture. The mixture was then heated to 80°C for 1-2 hours to obtain a clear suspension. The resulting suspension of functionalized colloidal silica was stored at room temperature. Preparation of various SiO 2 The dispersion was used in Example 2 at a content (10% to 30%).

Embodiment 2

[0107] A dispersion of functionalized colloidal silica in epoxy resin was prepared. 540 g of each predispersion prepared in Example 1 was charged into a 2000 ml round bottom flask. Table 1 below shows other pre-dispersion compositions. 1-Methoxy-2-propanol (750 g) was then added to each flask. The resulting functionalized colloidal silica dispersion was vacuum stripped at 60°C and 60 mmHg to remove 1 L of solvent. The vacuum was slowly reduced and the solvent was continuously removed with good stirring until the weight of the dispersion reached 140 g. Transparent phenyl-functionalized colloidal silica dispersion containing 50% SiO 2 And no precipitated silica. The dispersion is stable for more than three months at room temperature. The results in Table 1 show that in order to prepare concentrated and stable FCS dispersions in 1-methoxy-2-propanol (Dispersions 1-5), a certain amount of phenyl functionality is required. The content of functional groups can be adjusted to o...

Embodiment 3

[0113] A dispersion of capped functionalized colloidal silica in epoxy resin was prepared. 5.33 g of epoxy cresol novolac (ECN 195XL-25, obtained from Sumitomo Chemical Co.), 2.6 g of novolac hardener (Tamanol 758, obtained from Arakawa Chemical Industries) was heated to about 50°C. To 10.0 g of the FCS dispersion was added dropwise 7.28 g of a portion of the solution (see Table 1 above, item #3, 50% SiO in methoxypropanol) at 50°C while stirring 2). The clear suspension was cooled and a catalyst solution of N-methylimidazole, 60 microliters of a 50% w / w solution in methoxypropanol was added under stirring. The clear solution was directly used to cast a resin film for characterization or stored at -10°C. Other films were prepared using different amounts of different catalysts and certain variables of epoxides, as listed in Table 2 below showing the final resin composition.

[0114] Films were cast by dispersing a portion of the epoxy-silica dispersion on a glass plate, the...

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Abstract

The present invention provides compositions useful as underfill materials. The underfill contains a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition comprises at least one aromatic epoxy resin, and a solvent, a dispersion of functionalized colloidal silica, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, epoxy monomers, hydroxyaromatic compounds, and combinations and mixtures thereof to form solvent-modified resins. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions can be used to prepare an underfill and is suitable as an encapsulant for electronic chips.

Description

technical field [0001] The present invention relates to the combined use of a first curable resin composition and a second curable fluxing resin composition in underfill materials. More specifically, the first curable resin composition includes a thermosetting resin, a solvent, and functionalized colloidal silica. The second curable fluxing resin composition preferably includes a thermosetting epoxy resin and optional additives. The final cured composition has a low coefficient of thermal expansion and a high glass transition temperature. Background technique [0002] The need for smaller and more complex electronic devices continues to drive the electronics industry toward improved integrated circuit packages capable of supporting higher input / output (I / O) densities and features in smaller die areas. Enhance performance. Although the flip chip process has been developed to respond to these stringent requirements, the weakness of the flip chip configuration is that the sp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/29C08L63/00
CPCH01L2224/73203H01L21/563H01L2924/01079H01L2924/01025C08L63/00H01L2924/01019H01L24/29H01L2924/01322H01L2924/01029H01L2924/01078H01L2924/10253H01L2924/01012H01L2924/01087H01L23/293H01L2924/01077C08L2205/02H01L2924/181H01L2924/14Y10T428/31511Y10T428/31515C08L2666/22C08L83/00H01L2924/00C08L63/10C08K3/22B32B15/02
Inventor 桑迪普·S·托纳皮约翰·坎贝尔瑞安·米尔斯阿纳思·普拉巴库马斯拉沃米尔·鲁宾茨塔吉恩
Owner MOMENTIVE PERFORMANCE MATERIALS INC