Preparation method of anisotropic conductive rubber film

An anisotropic conductive adhesive and glue technology, which can be used in conductive materials dispersed in non-conductive inorganic materials, devices for coating liquid on surfaces, coatings, etc., which can solve the problem of increasing peel strength and reducing film curing temperature. , storage stability increase and other issues, to achieve the effect of good storage stability

Inactive Publication Date: 2007-02-28
YANTAI SHUODE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The technical problem to be solved is: by modifying the thermoplastic elastomer, it can participate in the reaction and increase the peel strength; by modifying the curing agent, the curing temperature of the adhesive film can be reduced, and the storage stability can be increased.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention is further illustrated below by specific examples.

[0030] The thermoplastic elastomer used in the present invention is self-developed hydroxyl-terminated liquid nitrile rubber modified epoxy resin. The epoxy resin is selected from solid bisphenol A epoxy resin. The curing agent is the self-developed imidazole modified curing agent JQE6114. Conductive particles are self-developed Ni / Au cross-linked polymer microspheres (including 2.5 μm, 3.5 μm, 4.5 μm, 7.5 μm in various specifications, Ni coating thickness 0.2 μm, Au coating thickness 0.02 μm), The solvent is a mixed solvent of toluene / ethyl acetate (1:1).

[0031] The basic recipe used is as follows:

[0032] Thermoplastic elastomer JEC6112 5-12 parts

[0033] Latent curing agent JQE6114 6-10 parts

[0034] Liquid epoxy resin JE6110-1 (epoxy equivalent 185-195g / ep) 5-10 parts

[0035] Liquid epoxy resin JE6110-2 (epoxy equivalent 245-270g / ep) 5-10 parts

[0036] Solid epoxy resin JE6110-3...

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PUM

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Abstract

The invention discloses a heteroscedasticity conducting glue film preparing method, which comprises the following steps: joining the elastoplastics of insulative resin and epoxide resin in the component solvent of toluol and ethyl acetate; heating and mixing; adding in the conducting particle after dissolving; stirring evenly; adding in the latent firming agent and chemical inhibitor, thixotropic agent and silane resin acceptor of insulating resin after reducing the temperature; mixing evenly to prepare the coarse glue; spreading the coarse glue on the treated disjuncting film of polyethylene glycol terephthalate;parching and forming the film.

Description

technical field [0001] The invention relates to a method for preparing an anisotropic conductive adhesive film. The anisotropic conductive adhesive film is called anisotropic conductive adhesive film (ACF) in the invention. The adhesive film is only conductive along its thickness direction (Z axis), and non-conductive in other directions (XY axis). Background technique [0002] The anisotropic conductive adhesive film is formed by dispersing conductive particles in an adhesive insulating resin composition. It is installed between the circuits facing each other, and under the condition of instantaneous pressure and heating, the circuits are connected by conductive particles, and the circuits are firmly bonded. [0003] The anisotropic conductive adhesive film is mainly composed of insulating resin, curing agent and conductive particles. The insulating resin contains thermosetting resin and thermoplastic resin. Thermosetting resin, as the main film-forming substance, reacts ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B05D7/04C08L63/02C08K5/5415H01B1/24C08K5/10C08K3/36
Inventor 纪克兵李兴存周小平豆帆朱洪维
Owner YANTAI SHUODE NEW MATERIAL
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