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Method for manufacturing circuit substrate

A technology of circuit substrate and manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuit, metal adhesion improvement of insulating substrate, etc. Effect

Inactive Publication Date: 2010-11-03
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a result, there is a problem that the cross-sectional shape of the circuit wiring deteriorates.

Method used

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  • Method for manufacturing circuit substrate
  • Method for manufacturing circuit substrate
  • Method for manufacturing circuit substrate

Examples

Experimental program
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Effect test

Embodiment approach 1

[0039] [Embodiment 1]

[0040] figure 1 It is a schematic diagram showing each step in Embodiment 1 of the present invention.

[0041] First, if figure 1 As shown in (1), prepare a double-sided metal tension laminate in which copper foil with a thickness of 4 μm is used as a conductive metal layer on both sides of an insulating base material 1 such as a polyimide film. 2 is formed by setting. Next, if figure 1 As shown in (2), a UV-YAG laser is irradiated to this double-sided metal tension laminate to form via holes 3 as through holes.

[0042] Next, if figure 1 As shown in (3), the conductive substance 4 is added to the double-sided metal tension laminate in which the via hole 3 is formed by conducting a tube (Conductron) treatment or the like. Next, if figure 1 As shown in (4), a photosensitive dry film-type resist (not shown) is laminated on the double-sided conductive metal layer 2 to which the conductive substance 4 is added, and pattern exposure and developme...

Embodiment 1

[0051] First, "Espanex" (thickness 25 μm) produced by Nippon Steel Chemical Co., Ltd. was prepared in advance as a double-sided non-adhesive copper tension laminate with copper foil on both sides of the polyimide film, and half-etching was performed so that The thickness of the conductive metal layer on both surfaces was 4 μm.

[0052] Next, via holes with a diameter of 50 μm were formed using a UV-YAG laser. Next, the electroconductive substance is added by the tube treatment.

[0053] Next, a photosensitive dry film with a thickness of 20 μm was laminated, followed by pattern exposure and development to form a resist film for double-sided conduction except via holes and their pads. Thereafter, by copper sulfate plating treatment, a plated layer having a thickness of 8 μm or more and 12 μm or less is obtained as conduction between the conductive metal layers on both surfaces.

[0054] Next, using sodium hydroxide, the resist film for double-sided conductive plating was peel...

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Abstract

Provided is a method of manufacturing a circuit board with which double-sided conductive metal layers are surely conducted in a double-sided circuit board and further, a cross-sectional shape of circuit wiring is not made worse. In a method of manufacturing a circuit board including a conduction structure formed from a through-hole or a bottomed via-hole, a conductive material is given by forminga conduction hole on a double-sided metal-clad laminate including conductive metal layers on both sides of an insulating base, a plating resist film 9 is formed excepting for said conduction hole anda land thereof, the plating resist film is released and removed after conducting the conductive metal layers and forming a circuit wiring pattern by plating, and the circuit wiring pattern is formed by removing the exposed conductive metal layers and electrically separating the circuit wiring pattern. The step of forming a plating layer for conduction between the double-coated conductive layers and the step of forming a plating layer for circuit wiring formation are performed separately from each other.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit substrate, in particular to a method for manufacturing a double-sided circuit substrate formed by performing high-density circuit wiring through electroplating. Background technique [0002] In the general-purpose etching method for circuit wiring formation, there is a limit in increasing the density in order to make the cross-sectional shape of the wiring into a trapezoidal shape. Therefore, a wiring formation method based on plating, which is more suitable for high-density circuit formation, has been used in the past. [0003] From Figure 4 (1) to Figure 5 (7) shows the manufacturing method of this double-sided circuit board. That is, first, as Figure 4 As shown in (1), a double-sided metal tension laminate with conductive metal layers 22 on both sides of the insulating base material 21 is prepared in advance, and then, as Figure 4 As shown in (2), the via hole 23 is formed in the ab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18H05K3/38
Inventor 国府田猛
Owner NIPPON MEKTRON LTD
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