Check patentability & draft patents in minutes with Patsnap Eureka AI!

Production method for wiring substrate

A technology for wiring substrates and manufacturing methods, applied in the directions of printed circuit manufacturing, circuit substrate materials, chemical instruments and methods, etc., can solve the problems of decreased flexibility and unsuitability of wiring substrates, and achieves suppression of warpage and conduction. bad effect

Active Publication Date: 2018-06-08
AGC INC
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flexibility of wiring boards using woven or non-woven fabrics decreases, making them unsuitable for flexible boards that require high flexibility.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Production method for wiring substrate
  • Production method for wiring substrate
  • Production method for wiring substrate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0176] In the case of manufacturing the wiring board 1 by the method (i), using Figure 1A Shown is a laminate 1A of the layer structure of first conductor layer 12 / electrical insulator layer 10 / second conductor layer 14 . The electrical insulator layer 10 has a layer structure of layer (A) 16 / layer (B) 18 / layer (A) 16 . Such as Figure 1B As shown, in the laminated body 1A, a hole 20 penetrating from the first conductor layer 12 to the second conductor layer 14 is formed by a drill, a laser, or the like. Next, under the condition of not performing etching treatment using metallic sodium, after performing either or both of permanganate solution treatment and plasma treatment on the inner wall surface 20a of the formed hole 20, as Figure 1C As shown, electroless plating or the like is performed on the inner wall surface 20 a of the hole 20 to form a plated layer 22 .

no. 2 approach

[0178] In the case of manufacturing the wiring board 2 by the method (i), using Figure 2A Shown is a laminate 2A of the layer structure of first conductor layer 12 / electrical insulator layer 10A / second conductor layer 14 . The electrical insulator layer 10A has a layer structure consisting of layer (A) 16 / layer (B) 18 . Same as the case of wiring board 1, such as Figure 2B As shown, a hole 20 penetrating from the first conductor layer 12 to the second conductor layer 14 is formed in the laminated body 2A. Next, under the condition of not performing etching treatment using metallic sodium, after performing either or both of permanganate solution treatment and plasma treatment on the inner wall surface 20a of the formed hole 20, as Figure 2C As shown, the plating layer 22 is formed on the inner wall surface 20 a of the hole 20 .

no. 3 approach

[0180] In the case of manufacturing the wiring board 3 by the method (i), using Figure 3A Shown is a laminate 3A of the layer structure of first conductor layer 12 / electrical insulator layer 10B / second conductor layer 14 . The electrical insulator layer 10 has a layer structure of layer (B) 18 / layer (A) 16 / layer (B) 18 . Same as the case of wiring board 1, such as Figure 3B As shown, a hole 20 penetrating from the first conductor layer 12 to the second conductor layer 14 is formed in the laminated body 3A. Next, under the condition of not performing etching treatment using metallic sodium, after performing either or both of permanganate solution treatment and plasma treatment on the inner wall surface 20a of the formed hole 20, as Figure 3C As shown, electroless plating or the like is performed on the inner wall surface 20 a of the hole 20 to form a plated layer 22 .

[0181] (method (ii))

[0182] Method (ii) has the following steps.

[0183] (ii-1) A step of formi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Provided is a method for producing a wiring substrate wherein, even without performing etching using metallic sodium, conduction failures in a hole formed in an electrical-insulator layer are suppressed and unforeseen deformation such as warping, etc., are suppressed even without said electrical-insulator layer containing a textile or non-woven cloth comprising reinforcing fiber. In the productionmethod for the wiring substrate 1: a hole 20 is formed in a laminate comprising a first conductor layer 12, an electrical-insulator layer 10, and a second conductor layer 14, said electrical-insulator layer including a specific fluorine resin layer (A) 16 and a heat-resistant resin layer (B) 18, not containing a reinforced-fiber base material, having a dielectric constant of 2.0-3.5, and having alinear expansion coefficient of 0-35 ppm / DEG C; the inside wall surface 20a of this hole 20 receives either or both permanganate solvent treatment and / or plasma treatment, without etching using a metallic sodium being performed; and then a plating layer 22 is formed on the inside wall surface 20a of the hole 20.

Description

technical field [0001] The present invention relates to a method of manufacturing a wiring board. Background technique [0002] In addition to information communication terminals such as mobile phones, high-speed and large-capacity wireless communication is widely used in automobiles and the like. In high-speed and large-capacity wireless communication, high-frequency signals are transmitted through antennas that transmit and receive information. As the antenna, for example, a wiring board including an electrical insulator layer and a conductor layer provided on the electrical insulator layer can be used. In a wiring board, conductor layers are formed on both surfaces of an electrical insulator layer, and these conductor layers are often electrically connected by a plating layer formed on an inner wall surface of a hole (through hole) penetrating the electrical insulator layer. In addition, antennas for transmitting and receiving radio waves are often formed using circuit ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K1/11B32B7/02B32B27/30B32B38/04H05K1/03B32B7/025
CPCH05K1/024H05K1/036H05K1/16H05K3/0055H05K3/427H05K2203/0789H05K3/0014H05K3/422H05K2201/015H05K2201/0154H05K2201/068H05K2201/10098H05K2203/095B32B2250/40B32B27/08B32B2307/306B32B3/266B32B2457/08B32B15/20B32B2250/05B32B2307/732B32B27/285B32B27/286B32B2264/10B32B27/281B32B27/34B32B27/322B32B27/36B32B27/288B32B2264/101B32B2264/067B32B15/082B32B2307/206B32B15/085B32B2264/104B32B2307/204B32B2264/108B32B15/08B32B27/20B32B2307/202B32B27/308B32B2255/06B32B27/306B32B2262/101B32B2255/205B32B27/304B32B7/025H01Q1/38H05K1/0313H05K1/115H05K3/429H05K3/4652H05K2203/0796B32B27/30H05K1/0271H05K1/0373H05K1/0393H05K3/0011
Inventor 细田朋也佐佐木徹木寺信隆寺田达也
Owner AGC INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com