Half-module chip integrated waveguide 90 degree three-decibel directional coupler

A half-mode substrate integration and directional coupler technology, applied in waveguide devices, electrical components, connecting devices, etc., can solve the problems of high cost, difficult processing, large radiation loss, etc., and achieve small size and low processing difficulty , The effect of small phase difference fluctuation

Inactive Publication Date: 2007-03-28
SOUTHEAST UNIV
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing millimeter-wave and microwave devices, there are two main forms of directional couplers that can...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Half-module chip integrated waveguide 90 degree three-decibel directional coupler
  • Half-module chip integrated waveguide 90 degree three-decibel directional coupler

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] A half-mode substrate integrated waveguide 90-degree three-decibel directional coupler related to millimeter wave and microwave devices described in this embodiment.

[0022] Referring to Fig. 2, this embodiment includes a dielectric substrate 1 covered with metal patches 2, 3 on both sides;

[0023] 1 and 3, on one side of the metal patch 2 are provided with an input terminal 41, an output terminal 42, an isolation terminal 51 and a coupling terminal 52, between the input terminal 41, the output terminal 42 and the isolation terminal 51, the coupling terminal 52 Metallized through-holes and coupling slots 6 arranged in rows are arranged between them. With such a structure, two half-mode substrate integrated waveguides 4, 5 are formed on the dielectric substrate 1 covered with metal patches 2, 3 on both sides, and two ends of one of the half-mode substrate integrated waveguides 4 are respectively set There is an input terminal 41 and an output terminal 42, and an isola...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The disclosed directional coupler includes medium base plate with metal patches on its two faces. Input end, output end, isolation end and coupling end are setup on one face of the metal patch. Since integration waveguide structure in halfmodule base plate reserves inherent characteristic of low loss and since aspect ratio of the integration waveguide is smaller than SIW, thus, the loss of electromagnetic wave generated in process of transmission caused by nonideal medium is smaller so as to possesses better characteristic of low loss. Using mature technique for fabricating printing circuit board in single layer to produce the structure of waveguide, the invention possesses features of low cost, satisfied precision and performance so that mass production is feasible.

Description

technical field [0001] The invention relates to a millimeter wave and microwave device, in particular to a half-mode substrate integrated waveguide 90-degree three-decibel directional coupler. Background technique [0002] In the existing millimeter-wave and microwave devices, there are two main forms of directional couplers that can achieve 90-degree phase difference output: microstrip form and waveguide form; Better, but the processing is difficult and costly. In recent years, the substrate-integrated waveguide (SIW) 90-degree three-dB directional coupler realized by the printed circuit board (PCB) process has excellent performance, but due to the limited thickness of the PCB board, the aspect ratio of the SIW structure is large, and the area of ​​the designed device It is also considerable. Therefore, it is of great practical significance to make further improvements on the basis of SIW and design a directional coupler with smaller size, lower loss and better performance...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01P5/18H01P5/12
Inventor 洪伟刘冰
Owner SOUTHEAST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products