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Vacuum chuck and suction board

A technology of vacuum chuck and adsorption plate, which is applied in the direction of clamping, supporting, positioning devices, etc., can solve the problems of semiconductor wafer 715 damage, increase in the number of processes, uneven bonding, etc., and achieve excellent grinding accuracy and flatness , the effect of not easy height difference

Active Publication Date: 2007-03-28
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in such a wafer polishing apparatus 700, the process of attaching or peeling the semiconductor wafer 715 is required, and thus there are problems in that the number of processes increases, and the semiconductor wafer 715 may be damaged during these processes.
Therefore, the accuracy will be lowered due to uneven bonding of the two or shifting of the gas-permeable die mounting plate.

Method used

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  • Vacuum chuck and suction board
  • Vacuum chuck and suction board
  • Vacuum chuck and suction board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0448] (1) 90% by weight of α-type silicon carbide powder with an average particle diameter of 60 μm and 10% by weight of α-type silicon carbide powder with an average particle diameter of 1.0 μm are wet-mixed, and then mixed in 100 weight units of the obtained mixture 5 weight units of an organic binder (methylcellulose) and 10 weight units of water were added, stirred, and then spray-dried to obtain a granular mixed composition for adsorption layer formation.

[0449] And, 90% by weight of α-type silicon carbide powder with an average particle diameter of 60 μm and 10% by weight of α-type silicon carbide powder with an average particle diameter of 1.0 μm were wet-mixed, and then added to 100 weight units of the obtained mixture 5 weight units of organic binder (methyl cellulose), 10 weight units of water, and 5 weight units of phenolic resin as a carbon source, stirred, and then spray-dried to obtain granular Mixed composition for compact layer formation.

[0450](2) Then, ...

Embodiment 2

[0464] In the step (2) of Example 1, the ratio of the mixed composition for forming the adsorption layer and the mixed composition for forming the compact layer put into the mold was set to 63:35. Similarly, the manufacture of the vacuum chuck is completed.

[0465] In addition, in the adsorption sheet manufactured in this example, the thickness ratio of the adsorption layer and the compact layer was 65:35.

Embodiment 3

[0467] In the step (2) of Example 1, the molar ratio of the mixed composition for forming the adsorption layer and the mixed composition for forming the dense layer into the mold was set to 20:80. Similarly, the manufacture of the vacuum chuck is completed.

[0468] In addition, in the adsorption sheet manufactured in this example, the thickness ratio of the adsorption layer and the compact layer was 20:80.

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Abstract

A vacuum chuck is provided for attaining uniform polishing of an object to be sucked. The vacuum chuck is provided by integrating a suction layer and a compact substance layer, which are formed of a porous ceramics, and positioning the suction layer on a side of sucking the object to be sucked. The vacuum chuck is provided with a suction board for sucking and holding the object to be sucked. The compact substance layer is formed by impregnating the porous ceramics with a metal.

Description

[0001] This application is based on Japanese patent application No. 2004-90105 filed on March 25, 2004, Japanese patent application No. 2004-93573 filed on March 26, 2004, and Japanese patent application No. 2004-93573 filed on March 26, 2004. The Japanese patent application No. 2004-93574 filed on March 26, 2004 and the Japanese patent application No. 2004-93575 filed on March 26, 2004 are the applications claiming the priority of the basic application. technical field [0002] The present invention relates to a method for adsorbing an adsorbed body such as a semiconductor wafer, and performing, for example, PVD (physical vapor deposition) treatment such as heat treatment, grinding treatment, grinding treatment, CVD (chemical vapor deposition) treatment, and sputtering of the adsorbed body. and other vacuum chucks and adsorption plates. More specifically, it relates to a vacuum chuck and a suction plate suitable for polishing the surface of a semiconductor wafer or the like. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23Q3/08B24B37/04B24B41/06H01L21/304B24B37/30H01L21/683
CPCB24B37/30H01L21/6838Y10T279/11B23Q3/08B24B37/27B24B37/34H01L21/304
Inventor 石川茂治桐山胜之
Owner IBIDEN CO LTD
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