Production of flexible circuit board

Abstract

The method comprises: providing a flexible baseplate made by sequentially stacking a polyamide baseplate, an alloy layer and a first copper layer; making first photo etching, and patterning the first copper layer and the alloy layer in order to form multi first conducting wire structures on the polyamide baseboard; forming second copper layer on the polyamide baseplate and the first conducting wire structures; finally, making the second photo etching to remove the second copper layer on the polyamide baseplate.

Description

【Technical field】 [0001] The present invention relates to a method for manufacturing a flexible circuit board with a grain soft film bonding manufacturing process, and in particular to a method for manufacturing a copper structure on a flexible circuit board with a grain soft film bonding manufacturing process. 【Background technique】 [0002] The development of driver IC packaging technology has evolved from the Tape Automatic Bonding Process (TAB Process) to the Chip On Flex or Chip On Film Process (COF Process). The driving force of the display comes from the continuous improvement of display resolution and the increasingly thinner and smaller portable devices suitable for the display. [0003] The chip soft film bonding manufacturing process (COF Process) is a technology for flip chip bonding (Flip Chip Bonding) on ​​a flexible circuit board (Flexible or Film Printed Circuit board, FPC) substrate. That is, the driver chip (IC) and its electronic components can be placed ...

AI Technical Summary

Problems solved by technology

When wet etching is used to form the copper metal wires 210, because the nickel-chromium alloy is less likely to be etched than copper metal, so when etching the alloy layer 202, if the etching time is insufficient, the alloy layer between the copper metal wires 210 cannot be completely removed. , will cause a micro-short between the copper metal wires 210; if the etching time is increased in order to confirm that the alloy layer between the copper metal wires 210 can be completely removed, over-etching (Over-etching) often occurs Due to the situation, the nickel-chromium alloy 202 at the bottom of the copper metal wire 210 has the problem of under-cutting (under-cut), which causes the foundation to be unstable.

In other words, although this solution can improve the problem of shrinking the top width, it may cause undercutting. Obviously, such a manufacturing process cannot effectively solve the problem

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