Wafer processing device and wafer processing method

Abstract

A sticking device (15) is constructed from a sticking table (40) supporting a semiconductor wafer (W), a sticking unit (41) for sticking a heat-sensitive adhesive sheet (S), and a cutter (96) for cutting the adhesive sheet crosswise and peripherally for each semiconductor wafer. The table comprises the first sticking table (40) controlled to a first temperature for temporarily sticking the adhesive sheet (S) to the wafer (W), an outer periphery cutting table (47) controlled to a second temperature which lowers the stickiness of the adhesive sheet for cutting the latter, and a connecting table (48) controlled to a third temperature for completely sticking the adhesive sheet (S) to the wafer (W).

Description

technical field [0001] The present invention relates to a wafer processing apparatus and a wafer processing method, in particular to a wafer processing apparatus capable of reliably bonding a heat-sensitive adhesive sheet to an adherend while cutting the heat-sensitive adhesive sheet according to the size of the adherend. Wafer handling methods. Background technique [0002] After the semiconductor wafer on which the circuit surface is formed (hereinafter referred to as "wafer") is separated into chips, each chip is picked up and bonded (die bonding) to a lead frame. This die bonding can be performed by attaching a thermally-adhesive adhesive sheet used for die bonding in advance in a wafer processing step. [0003] As an sticking device of such an adhesive sheet, it is disclosed by patent document 1, for example. The sticking device disclosed in this document has a first table, a sheet supply device, a pressure roller, a cutter, a second table, and a heating device; Prel...

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Problems solved by technology

Therefore, in addition to being difficult to smoothly perform the cutting operation by the cutter, there is also a problem that the adhesive transfers to the blade edge region of the cutter during cutting, and is temporarily bonded to the wafer after cutting along the outer peripheral edge of the wafer. Wafer bonding sheet cannot be cut with good precision

[0009] In addition, there is also such a problem that since the first table for temporary bonding of the adhesive sheet is kept at the preliminary heating temperature, when an adhesive sheet having a larger planar area than the wafer is attached, the wafer may be damaged. The part of the adhesive sheet protruding from the outer peripheral edge of the wafer is firmly bonded to the table, and it is difficult to remove the unnecessary adhesive sheet part on the outer peripheral side after cutting the adhesive sheet along the outer edge of the wafer

On the other hand, if the above-mentioned useless adhesive sheet part is not bonded to the first stage at all, then the useless adhesive sheet part becomes a free state, so when the adhesive sheet is stuck on the wafer, the adhesive sheet will be held by its posture. The holding tension and the pressing force of the pressure roller are stretched, wrinkles occur, and air bubbles are entangled between the wafer and the adhesive sheet, which will become the main cause of poor adhesion of the adhesive sheet

[0010] In addition, in the configuration disclosed in Patent Document 1, for a wafer to which a raw material sheet (original シィト) in a state where an adhesive sheet and a protective tape are superimposed is attached, the wafer is transferred by a robot to the above-mentioned strip for peeling off the wafer. When the protective tape is placed on the stage, it needs to return to normal temperature for a while, so it takes time for cooling down, which reduces the processing efficiency when the wafer processing process is carried out as a whole.

In addition, since the temperature control is not performed when the wafer is transferred from the first stage to the second stage, the wafer is heated after the wafer is transferred to the second stage. The main reasons for the decline in wafer processing efficiency

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