Method for manufacturing a conductive composition and a rear substrate of a plasma display
A technology of plasma display and conductive composition, which is applied in the direction of alternating current plasma display panel, conductive material dispersed in non-conductive inorganic material, cold cathode manufacturing, etc., to achieve the effect of high tolerance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0114] A UV photosensitive thick film conductive composition was used in this example.
[0115] Method for Measuring the Average Particle Size of Ag
[0116] The average particle size can be defined as d50, which is obtained by measuring the particle size distribution using the laser diffraction scattering method. Microtrac model X-100 is an example of a commercially available device.
[0117] 0.5 g of powder was weighed and added to a beaker, and then a dispersion medium, which was formed by dissolving 0.2% of a dispersant (Darvan C) in 100 ml of pure water, was added to the beaker. The resulting solution was stirred for 5 minutes with a 200W ultrasonic stirring device. The resulting solution was then measured for 75 seconds using a Microtrac model X-100 to obtain a d50 value. The average particle diameter was obtained from the obtained d50 value.
[0118] A. Preparation of organic medium
[0119] As a solvent, Texanol (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate) an...
Embodiment 2-6 and comparative example 1-5
[0130] A conductive composition was prepared following the same procedure as in Example 1 except that the ingredients were changed to those shown in Table 1.
[0131]
Embodiment 9-12 and comparative example 6-7
[0136] In these Examples and Comparative Examples, the effect of the particle size of the silver powder in the conductive composition of the present invention was examined.
[0137] A conductive composition was prepared following the same procedure as in Example 1 except that the ingredients were changed to those shown in Table 3. Furthermore, chemical etching resistance and resolution evaluated by the following evaluation methods are also shown.
[0138] sample
comparative example
6
Example
9
Example
10
Example
11
Example
12
comparative example
7
Ag PSD(d50)
0.5 micron
1.0 microns
1.5 microns
2.0 microns
2.5 microns
3.0 microns
glass frit
Pb-type
Pb-type
Pb-type
Pb-type
Pb-type
Pb-type
Glass frit temperature (°C)
499
499
499
499
499
499
Glass frit / Ag
1.5 / 98.5
1.5 / 98.5
1.5 / 98.5
...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| softening point | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 