Epoxy composite of semi-solidified sheet and its use

A technology of epoxy resin and prepreg, applied in epoxy resin glue, adhesive type, chemical instrument and method, etc., can solve the problems of poor construction, low glass transition temperature, poor dimensional stability, etc. Hydrophobicity and insulation, overcoming the effect of low heat resistance

Inactive Publication Date: 2007-05-02
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent BE 627,887 discloses that styrene-maleic anhydride copolymer can be used as a crosslinking agent for epoxy resin, but the glass transition temperature of the epoxy resin compound of this invention is too low, the dimensional stability is poor, and the construction is not good

Method used

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  • Epoxy composite of semi-solidified sheet and its use
  • Epoxy composite of semi-solidified sheet and its use
  • Epoxy composite of semi-solidified sheet and its use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The epoxy resin composition is prepared according to the following component ratio (mass ratio):

[0018] The proportions of the composition are as follows:

[0019] Brominated bisphenol A type epoxy resin 79.99%, bromine content 20%, epoxy equivalent 400-450;

[0020] Styrene-maleic anhydride copolymer (SMA) 10%, weight average molecular weight (MW) = 1,300; maleic anhydride (mass percentage) in SMA copolymer 15.5%; m: n = 4: 1;

[0021] Accelerator 2-methylimidazole 0.01%;

[0022] The solvent is 10% of the mass of the composition.

[0023] The laminate production process is as follows:

[0024] Epoxy resin and styrene-maleic anhydride copolymer (SMA) added in a certain proportion are dissolved with an appropriate amount of dimethylformamide (DMF) as a solvent, and then 0.01% 2-methylimidazole is added as a curing accelerator to fully Stir evenly to make resin glue, stir for 1 hour, and the gel time measured by a gel time tester is 200s / 170°C.

[0025] Immerse th...

Embodiment 2

[0027] This epoxy resin mixture is prepared according to the following component ratio (mass ratio):

[0028] The proportions of the composition are as follows:

[0029] Brominated bisphenol A type epoxy resin 50%, bromine content 20%, epoxy equivalent 400-450;

[0030] Styrene-maleic anhydride copolymer (SMA) 36%, weight average molecular weight (MW)=10,000; Maleic anhydride (mass percentage composition) 18% in SMA copolymer; m: n=4: 1;

[0031] The accelerator 2-methylimidazole is 4%; the solvent is 10% of the mass of the composition.

[0032] The production process of this laminated board is as embodiment 1. The laminate has good thermal stability, with a Tg of about 175°C (measured by DSC), and when the resin content of the substrate is more than 40%, its dielectric constant (εr) and dielectric loss (tanδ) are: 4.0 and 0.01 or less.

Embodiment 3

[0034] The epoxy resin composition is prepared according to the following component ratio (mass ratio):

[0035] The proportions of the composition are as follows:

[0036] Brominated phenolic resin epoxy resin 10%, bromine content 19%, epoxy equivalent 400-430;

[0037] Styrene-maleic anhydride copolymer (SMA) 74%, weight average molecular weight (MW)=50,000; Maleic anhydride (mass percentage composition) 17.5% in SMA copolymer; m: n=4: 1;

[0038] The accelerator 2-methylimidazole is 6%; the solvent is 10% of the mass of the composition.

[0039] The production process of this laminated board is as embodiment 1.

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Abstract

This invention is an epoxide resin composite, and its feature is that benzene vinyl-Maleic Anhydride interpolymer, 2-methyl glyoxaline and solvent are added into epoxide resin according a certain proportion. Its components weight amount is that epoxide resin 10-79.99%, SMA interpolymer 10-74%, 2-methyl glyoxaline 0.01-6%. The solvent is dimethylformamide(DMF), and its weight amount is 10%. The feature of this invention is that when epoxide resin composite solidifies, SMA is not only the curing agent of the composite, but also contributes to the formation of network structure of the solidified product. This solidified product overcomes the fragibility of present epoxide resin solidification, and improve its wet fastness,tenacity and heat stability. This epoxide resin composite can be used in the production of binding agent and laminated wood of composite multilayer electric circuit panel.

Description

technical field [0001] The invention belongs to the field of macromolecular materials, and the composition of epoxy resin and styrene-maleic anhydride copolymer can be used in the manufacturing industry of adhesives, composite materials and laminated boards for multilayer circuit boards. Background technique [0002] Epoxy resin is the main material of multilayer circuit boards widely used in various electrical appliances and various electronic components. Most of the epoxy resin curing agents currently used are dicyandiamide curing agents. The disadvantage is that in high-frequency circuits, the epoxy resin system will cause signal loss due to its high dielectric constant and dissipation factor. The heat resistance and moisture resistance of the resin curing system are not high, and it is difficult to adapt to the soldering process of the lead-free solder that will be applied at present. [0003] Styrene-maleic anhydride copolymer (SMA) is a new type of high-performance re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/3472C09J163/02B32B37/12
Inventor 高延敏王鹏
Owner JIANGSU UNIV OF SCI & TECH
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