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Superhigh strength high conduction block pure copper material and preparation method

A high-conductivity, ultra-high-strength technology, applied in the field of bulk high-density nano-twinned metal pure copper and its preparation, achieves the effects of simple preparation method, excellent conductivity and strong applicability

Inactive Publication Date: 2007-05-02
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, whether the method of work hardening or grain refinement is adopted, there is a considerable gap between the yield strength of the bulk copper material currently prepared and the yield strength of the whiskers or the theoretical shear strength of the material. Improving the yield strength of current bulk copper offers the possibility of

Method used

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  • Superhigh strength high conduction block pure copper material and preparation method
  • Superhigh strength high conduction block pure copper material and preparation method
  • Superhigh strength high conduction block pure copper material and preparation method

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Experimental program
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Effect test

Embodiment 1

[0027] Using high-speed deformation technology to prepare high-strength, high-conductivity bulk high-density nano-twinned pure copper materials;

[0028] Equipment: Pneumatic high-speed deformation equipment;

[0029] Deformation strain rate: 1×10 2 the s -1 ;

[0030] Deformation strain: deformation 2.3 (5 deformations, each deformation of the first four deformations is 0.5, and the fifth deformation is 0.3);

[0031] Deformation temperature: -196°C;

[0032] Pure copper material: purity 99.95%, annealed at 700°C for 3 hours, grain size 150-200 microns.

[0033] A bulk high-density nano-sized twinned pure copper material is prepared, as shown in Figure 1. The main feature of its microstructure is bundle-shaped high-density nano-mechanical twins, with an average twin layer thickness of 30-50 nanometers and a length of 200-800 nanometers. The twin density is about 3×10 7 m 2 / m 3 . There are high-density dislocations in both the matrix and the twins, and the dislocatio...

Embodiment 2

[0035] Using high-speed deformation technology to prepare high-strength, high-conductivity bulk high-density nano-twinned pure copper materials;

[0036] Equipment: Pneumatic high-speed deformation equipment;

[0037] Deformation strain rate: 1×10 3 the s -1 ;

[0038] Deformation strain: deformation 2 (4 deformations, each deformation 0.5);

[0039] Deformation temperature: -100°C;

[0040] Pure copper material: purity 99.95%, annealed at 700°C for 3 hours, grain size 150-200 microns.

[0041] A bulk high-density nano-sized twinned pure copper material is prepared, as shown in Figure 1. The main feature of its microstructure is bundled high-density nano-mechanical twins, with an average twin layer thickness of 30-50 nanometers and a length of 100-600 nanometers. The twin density is about 1.5×10 7 m 2 / m 3 . There are high-density dislocations in both the matrix and the twins, and the dislocation density is 1.3×10 15 . Using a strain rate of 6 x 10 -3 the s -1 A ten...

Embodiment 3

[0043] Using high-speed deformation technology to prepare high-strength, high-conductivity bulk high-density nano-twinned pure copper materials;

[0044] Equipment: Pneumatic high-speed deformation equipment;

[0045] Deformation strain rate: 1×10 4 the s -1 ;

[0046] Deformation strain: deformation 2.5 (5 deformations, each deformation 0.5);

[0047] Deformation temperature: -20°C;

[0048] Pure copper material: purity 99.95%, annealed at 700°C for 3 hours, grain size 150-200 microns.

[0049] A bulk high-density nano-sized twinned pure copper material is prepared, as shown in Figure 1. The main feature of its microstructure is bundle-shaped high-density nano-mechanical twins, with an average twin layer thickness of 30-50 nanometers and a length of 200-800 nanometers. The twin density is about 1.5×10 7 m 2 / m 3 . There are high-density dislocations in both the matrix and the twins, and the dislocation density is 1×10 15 . Using a strain rate of 6 x 10 -3 the s -...

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Abstract

This invention relates to an improved technique of nanometer crystal material, particularly relating a metallic pure copper of block high density nanometer twin crystal with super strong intensity, high conductivity and its preparation. Key feature of microstructure of block pure copper is of mechanical twin crystal of fascicularis high density nanometer, average slice thickness of twin crystal is some ten nanometers, length is hundreds nanometers. Both interior of basal body and twin crystal has dislocation with high density, its tensile yield strength is about 750MPa, its resistivity achieves at 1.81*10-8 omega m. Preparation of block pure copper material with super strong intensity, high conductivity is using dynamic high speed transfiguring technique, to carry out many times process of single direction for block pure copper, modified deformation rate: circumscription is 102-104s-1;Modified deformation variance: total deformation variance is more than 1.8 (computing method: epsilon=H0 / H greater than 1.8); deformation temperature: 30deg.C to 200deg.C.

Description

technical field [0001] The invention relates to the improvement technology of nano-crystal materials, in particular to a block high-density nano-twin metal pure copper with ultra-high strength and high conductivity and a preparation method thereof. Background technique [0002] Copper is one of the first metals discovered and used by humans. At present, copper and copper alloys have been widely used in industrial sectors such as electrical, electronic, mechanical, instrumentation, shipbuilding and construction. At the end of the 20th century, the world's copper production was about 14.5 million tons. Pure copper has good electrical conductivity, but its strength is low, and the tensile yield strength of annealed pure copper at room temperature is only about 30MPa. In order to improve the performance of copper, it is usually necessary to add some less harmful alloying elements (such as Al, Fe, Ni, Sn, Zn, Ag, Sb, etc.) to improve its strength and hardness. However, the add...

Claims

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Application Information

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IPC IPC(8): C22F1/08
Inventor 陶乃镕李玉胜卢柯
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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