Heat-conductive glue

A technology of thermally conductive adhesive and substrate, applied in the field of heat transfer, can solve the problems of poor thermal conductivity of thermally conductive adhesive, poor wetting ability of silicone oil, large substrate thickness, etc., and achieves improved thermal conductivity, reduced thickness, and reduced substrate thickness. Effect

Inactive Publication Date: 2007-05-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The thermally conductive adhesive provided by the prior art generally uses materials such as silicone oil as the matrix. Due to the poor wetting ability of silicone oil, the thickness of the matrix between the thermally conductive powder and between the thermally conductive powder and the surface of the thermally conductive adhesive is relatively large. poor

Method used

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  • Heat-conductive glue

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Embodiment Construction

[0008] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0009] Please refer to FIG. 1 , which provides a thermally conductive adhesive 10 according to an embodiment of the present invention, which includes a matrix 11 and thermally conductive powder 12 dispersed in the matrix 11 .

[0010] The matrix 11 is a polyol, and the characteristic of the polyol is that it has a strong wettability, which can reduce the thickness of the matrix 11 filled between the heat-conducting powder 12 and between the heat-conducting powder 12 and the surface 13 of the heat-conducting adhesive 10, thereby reducing the thickness of the matrix 11. Improve the thermal conductivity of the thermally conductive adhesive 10 . The polyhydric alcohol can be one or a mixture of ethylene glycol, polyethylene glycol, polyhydroxy ester, polyhydroxy ether, polyhydroxy ketone, polyhydroxy alkene or polyhydroxy acid. The polyhydroxy ester can be polyh...

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Abstract

The invetnio disclosese heat conductive glue, which consists of base and heat conductive powder in the base, wherein the base is polyol, which possesses strong wetting ability; the thickness among heat conductive powders and between heat conductive powder and heat conductive glue surface becomes thinner, which improves heat conductive property of heat conductive glue.

Description

【Technical field】 [0001] The invention relates to the field of heat transfer, in particular to a heat-conducting glue. 【Background technique】 [0002] As integrated circuits become more dense and miniaturized, electronic components become smaller and operate at higher speeds, making their heat dissipation requirements increasingly demanding. Therefore, in order to dissipate the heat from the heat source as soon as possible, it has become a common practice in the industry to install a heat sink on the surface of the electronic component. It utilizes the high thermal conductivity of the material of the heat sink to quickly dissipate the heat to the outside. However, the distance between the heat sink and the surface of the heat source There is often a certain gap, so that the surface of the heat sink and the heat source cannot be in close contact, which becomes a major defect in the heat dissipation of the heat sink. Aiming at the problem of contact between the heat sink and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/00C09K5/00
Inventor 萧博元林孟东
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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