Heat-conductive glue

Abstract

The invetnio disclosese heat conductive glue, which consists of base and heat conductive powder in the base, wherein the base is polyol, which possesses strong wetting ability; the thickness among heat conductive powders and between heat conductive powder and heat conductive glue surface becomes thinner, which improves heat conductive property of heat conductive glue.

Description

【Technical field】 [0001] The invention relates to the field of heat transfer, in particular to a heat-conducting glue. 【Background technique】 [0002] As integrated circuits become more dense and miniaturized, electronic components become smaller and operate at higher speeds, making their heat dissipation requirements increasingly demanding. Therefore, in order to dissipate the heat from the heat source as soon as possible, it has become a common practice in the industry to install a heat sink on the surface of the electronic component. It utilizes the high thermal conductivity of the material of the heat sink to quickly dissipate the heat to the outside. However, the distance between the heat sink and the surface of the heat source There is often a certain gap, so that the surface of the heat sink and the heat source cannot be in close contact, which becomes a major defect in the heat dissipation of the heat sink. Aiming at the problem of contact between the heat sink and ...

AI Technical Summary

Problems solved by technology

The thermally conductive adhesive provided by the prior art generally uses materials such as silicone oil as the matrix. Due to the poor wetting ability of silicone oil, the thickness of the matrix between the thermally conductive powder and between the thermally conductive powder and the surface of the thermally conductive adhesive is relatively large. poor

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