Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier

A manufacturing method and smart card technology, applied in the field of smart cards, can solve problems such as inflexibility and achieve the effect of simplifying manufacturing

Active Publication Date: 2007-05-30
立联信控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this manufacturing method is inflexible due to the

Method used

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  • Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier
  • Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier
  • Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier

Examples

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Example Embodiment

[0031] Figures 1, 2 and 3 show top views of the first surface of the carrier tape. Figure 4 shows a top view of the second surface opposite the first surface. Therefore, Figures 1, 2 and 3 and Figure 4 show top views of both sides of the smart card body according to the present invention.

[0032] It can be seen from FIG. 1 that a large number of smart card bodies 10 are manufactured on the carrier tape 100. The carrier tape 100 is formed of a conductive layer 1 preferably composed of a copper sheet. However, other conductive materials, such as aluminum, can also be used. The carrier tape 100 is preferably composed of a roll of conductive layer 1, so that a large number of smart card main bodies 10 can be manufactured using the roll-to-roll method.

[0033] The manufacturing method of the smart card main body 10 containing the semiconductor chip will be explained with reference to FIGS. 1, 2 and 3.

[0034] First, the conductive layer 1 is drilled, and a lead frame is formed in th...

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Abstract

The present invention relates to a smart card body, a smart card, and a manufacturing process for the same, and in particular to smart cards used for subscriber identity modules (SIM) cards. To improve a process for the manufacture of a smart card body and a process for the assembly of a smart card in such a manner that a simple and adaptable process can be achieved for the manufacture of a smart card, a process for the manufacture of a smart card body for incorporating a semiconductor chip is described, wherein the process comprises the formation of a lead frame in a conductive layer, wherein the lead frame has first contacts on a first surface and can be connected to the semiconductor chip on a second surface opposite the first surface, and the formation of a electrically insulating casing layer on the second surface of the smart card body, wherein the casing layer has a recess for incorporating the semiconductor chip.

Description

technical field [0001] The present invention relates to a smart card body, a smart card and a manufacturing method thereof, in particular, to a smart card used as a Subscriber Identity Module (SIM) card. Background technique [0002] According to conventional manufacturing methods of smart cards, the smart card body and the chip card module are manufactured separately. The chip card module is usually embedded in the smart card body before cutting the smart card body provided with the chip card module. [0003] US6288904 shows a chip card module contained within a smart card body. The chip is located on a circuit carrier and is connected by wire bonds to contacts located on opposing locations on the circuit carrier. The chip is enclosed in a frame with a filler surrounding the frame to protect the chip and wire bonds from mechanical stress. [0004] US5147982 discloses a method of packaging semiconductor chips in a micromodule, wherein the micromodule can be incorporated i...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/56H01L23/498H01L23/31G06K19/077
CPCH01L2924/0002G06K19/07745G06K19/07718G06K19/07724G06K19/07743H01L2924/00G06K19/07G06K19/077
Inventor 塞巴斯蒂安·卡尔克弗雷德里克·摩根塔勒
Owner 立联信控股有限公司
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