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Electrostatic chuck

An electrostatic chuck and electrode technology, which is applied in the direction of holding devices, circuits, and electrical components that apply electrostatic attraction, can solve problems such as difficulty in maintaining the adsorption force at the same time, and achieve the effect of reducing the contact area

Active Publication Date: 2007-06-27
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, it is difficult for an electrostatic chuck utilizing Coulomb force to simultaneously maintain the adsorption force and reduce the particles attached to the substrate

Method used

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Examples

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Embodiment 1

[0102] In Example 1, as shown in FIG. 1 , an electrostatic chuck 10 including a substrate 11 , electrodes 12 , dielectric layer 13 , protrusions 13 a and terminals 14 was produced.

[0103] First, the base body 11 is formed. Specifically, as a ceramic raw material powder, a mixed powder of alumina powder having a particle diameter of 1 μm and a purity of 99.5% was prepared by mixing 0.04% of magnesia with a particle diameter of 1 μm. PVA (Poly vinyl alcohol: polyvinyl alcohol) as a binder, water, and a dispersion material were added to the ceramic raw material powder, and mixed for 16 hours using a drum sieve to obtain a slurry.

[0104] Granulated granules were produced by spray granulation. Specifically, the obtained slurry was spray-dried with a spray dryer to produce granulated particles having an average particle diameter of 80 μm. Put the obtained granulated particles into a rubber mold and use cold isostatic pressing (Cold Isostatic Pressing, hereinafter referred to a...

Embodiment 2～ Embodiment 11

[0117] In Examples 2 to 11, as shown in FIG. 1 , an electrostatic chuck 10 including a substrate 11 , electrodes 12 , dielectric layer 13 , protrusions 13 a , and terminals 14 was produced in the same manner as in Example 1.

[0118] Examples 2 to 11, as shown in Table 1, changed the contact area ratio, protrusion diameter, protrusion height H, protrusion surface roughness, and 100 cm per unit area from Example 1. 2 The number of protrusions 13a of the electrostatic chuck. In addition, the manufacturing method of Example 2 - Example 11 is the same as that of Example 1.

Embodiment 12

[0120] In Example 12, as shown in FIG. 1 , an electrostatic chuck 10 including a substrate 11 , electrodes 12 , dielectric layer 13 , protrusions 13 a , and terminals 14 was produced in the same manner as in Example 1.

[0121] Example 12 is an electrostatic chuck 10 in which volume resistivity was changed from Example 1 as shown in Table 2 by not mixing magnesium oxide when fabricating the substrate 11 . The manufacturing method of Example 12 except the mixing of magnesium oxide is the same as Example 1.

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Abstract

An electrostatic chuck includes: a base body; an electrode formed on the base body and generating coulomb force; and a dielectric layer formed on the base body and electrode, having a plurality of projections on a first main face on the side supporting a substrate attracted by the coulomb force, and supporting the substrate on the upper surfaces of these projections. The projections are arranged at substantially uniform intervals. The surface roughness (Ra) of the projection upper faces is 0.5 mum or smaller. The height of the projections is 5 to 20 mum. The relation A<1 / 2>xB<2>>200 is satisfied where A (number / 100 cm<2>) is the number of the projections per unit area of 100 cm<2 >in the first main face, and B (mum) is the height of the projections.

Description

technical field [0001] The present invention relates to an electrostatic chuck utilizing Coulomb force. Background technique [0002] Originally, in processes such as exposure, PVD (Physical Vapor Deposition: Physical Vapor Deposition), CVD (Chemical Vapor Deposition: Chemical Vapor Deposition), etching, etc. electrostatic chuck. Among the electrostatic chucks, some use Coulomb force to attract the substrate, and some use Johnson-Rabeck Johnsen-Rahbeck (hereinafter referred to as J-R) force to attract the substrate. [0003] Conventionally, processes such as exposure, PVD, CVD, and etching have had the problem of attracting particles when attaching substrates to electrostatic chucks. In addition, there are problems such as the uniformity of the temperature distribution of the substrate. [0004] In this regard, the following proposals have been proposed: provide protrusions on the surface of the electrostatic chuck, and reduce the particles adsorbed on the substrate by re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6875H01L21/6831H02N13/00H01L21/68
Inventor 森冈育久鹤田英芳川尻哲也鸟越猛
Owner NGK INSULATORS LTD