Semiconductor cooling arrangement
a technology of semiconductors and cooling arrangements, applied in semiconductor devices, semiconductor/solid-state device details, electrical apparatus, etc., can solve problems such as failure, failure, and failure of devices, and achieve the effect of improving the cooling arrangement and removing further hea
Active Publication Date: 2021-04-20
YASA LIMITED
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AI Technical Summary
Benefits of technology
This arrangement significantly increases power density and maximum power handling of power inverters and semiconductor switch devices by improving heat removal and reducing joule heating losses, allowing for more compact and efficient designs.
Problems solved by technology
Devices have limitations on the upper temperature at which they may be effectively operated and as limit temperatures are breached so devices may become less efficient and may fail.
In most instances devices are unable to recover from failures due to overheating and the whole system in which they are a part becomes unusable, requiring repair or in many cases “burnt out” modules / systems are replaced.
However increasing the size of a heat sink increases the weight and volume of a power supply module and correspondingly the cost.
Though heat loss from any one device is small, integration density has led to total heat dissipation being high and is a severe limitation on speed and lifetime of CPUs.
A disadvantage of US2011 / 103019 is poor heat spreading through said substrate and particularly poor heat spreading through connections to said printed circuit board.
Teaching of US2014204532 is to liquid-in-air jets and is thereby limited in its cooling capacity and because cooling is at chip scale, pinout configurations further limit the connectivity of such cooling arrangements.
However though these direct bonded substrates are good thermal conductors they are also expensive to manufacture and difficult to handle and carry out repairs.
A compromise is reached which inevitably leads to joule heating losses in semiconducting device switches.
Despite best attempts all cooling approaches to date have been deficient in their cooling abilities and cooling efficiency of power semiconductor components has been a limiting feature of maximum power handling and power density for power semiconducting switch devices and hence power inverters.
Method used
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[0071]In brief, the present invention relates to a semiconductor cooling arrangement in which one or more semiconductor assemblies are located in a chamber within a housing. The housing comprises inlet and outlet ports for receiving and outputting a cooling medium. The chamber is flooded with a cooling medium to cool the assemblies. The assemblies themselves each comprise a heatsink and one or more semiconductor power devices thermally coupled to the heatsink. The heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from one surface to another surface such that the cooling medium flows through the holes to extract heat from the heatsink.
[0072]With reference to FIGS. 1 and 2 there is seen in schematic format semiconductor device cooling arrangements 100, 200 which are typical prior art approaches to cooling used for high heat flux components. There is shown an indirect means of heat removal FIG. 1 for a group 1...
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The present invention relates to a semiconductor cooling arrangement for cooling semiconductor devices, such as power semiconductors. The semiconductor cooling arrangement comprises one or more semiconductor assemblies located in a chamber within a housing. The housing comprises inlet and outlet ports for receiving and outputting a cooling medium. The chamber is flooded with a cooling medium to cool the assemblies. The assemblies themselves each comprise a heatsink and one or more semiconductor power devices thermally coupled to the heatsink. The heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from one surface to another surface such that the cooling medium flows through the holes to extract heat from the heatsink.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a semiconductor cooling arrangement for cooling semiconductor devices, such as power semiconductors. Such arrangements are advantageous in the field of inverters due to the high power losses and associated heat generated by such devices.BACKGROUND OF THE INVENTION[0002]Electrical and electronic components generate heat as a by-product when they are in use. Overheating usually impacts performance and component lifetime and therefore electrical and particularly electronic components are typically cooled to prevent overheating.[0003]Devices have limitations on the upper temperature at which they may be effectively operated and as limit temperatures are breached so devices may become less efficient and may fail. In most instances devices are unable to recover from failures due to overheating and the whole system in which they are a part becomes unusable, requiring repair or in many cases “burnt out” modules / systems are replace...
Claims
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IPC IPC(8): H01L23/473H01L23/14H01L23/36H01L23/40
CPCH01L23/473H01L23/14H01L23/36H01L23/40H01L23/367H01L23/3672H01L23/44H01L25/115H01L2224/16225H01L25/072H01L25/18H05K7/20927H05K7/20936
InventorHART, SIMON DAVIDWOOLMER, TIMMALAM, CHRISTOPHER STUARTLAW, GRAHAMBUMPUS, FRANCESCA BERNARDINE
OwnerYASA LIMITED