Apparatus and method for non-destructive, low stress removal of soldered electronic components

Abstract

Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

Description

1. 1. Technical Field of the Invention2. This invention pertains to an apparatus and method for removing soldered electronic components from a substrate. More particularly, it relates to non-destructive, low stress removal of chips temporarily soldered to a substrate during Known-Good-Die (KGD) processing of flip chip devices.3. 2. Background Art4. As technology has evolved, semiconductor devices have become smaller and more dense, which has resulted in corresponding increases in overall chip failure rates, which in turn results in uncompetitive situations for chip manufacturers. In order to readily identify and eliminate the use of defective chips before the defective chips are finally mounted in a product, burn-in processes have evolved. During the burn-in process, normally a chip carrier is provided for testing the chips. The chip carrier has electrical contacts which correspond to the electrical contacts on the semiconductor chip. It is desirable for the carrier contacts to be m...

AI Technical Summary

Problems solved by technology

4. As technology has evolved, semiconductor devices have become smaller and more dense, which has resulted in corresponding increases in overall chip failure rates, which in turn results in uncompetitive situations for chip manufacturers.

These forces typically fracture the solder balls, leaving some solder attached to the substrate and some to the chip.

First, since components (carrier, chip, cavity, etc.) have inherent dimensional variability, an undetermined quantity of assemblies are subjected to the shear ...

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