Wiring substrate, wiring board, and wiring substrate mounting structure

US20020074654A1Inactive Publication Date: 2002-06-20KYOCERA CORP
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
KYOCERA CORP
Publication Date
2002-06-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

In a wiring substrate, a high-frequency component is carried on a dielectric board having a transmission line formed on its surface, a reverse surface of the dielectric board is formed with an opening in a predetermined cross-sectional shape, and a high-frequency connecting pad is formed around the opening. In the wiring board, a dielectric board penetrates a waveguide structure and has its inner wall coated with a conductor, and a high-frequency connecting pad is formed on a surface of the dielectric board. The wiring substrate is placed on the wiring board, and the respective high-frequency connecting pads are electrically connected to each other, to fabricate a module. Even when a low-cost material having a large dielectric loss tangent is used for the wiring board, a high-frequency signal can be prevented from being attenuated.
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Description

[0001] This application is based on application No. 2000-361749 filed in Japan, the content of which is incorporated hereinto by reference.

[0002] 1. Field of the Invention

[0003] The present invention relates to a wiring substrate used in a microwave region or a millimeter wave region, a wiring board, and a wiring substrate mounting structure.

[0004] 2. Description of the Related Art

[0005] It has been examined whether or not an electric wave is made use of for transmitting information from a microwave region of 1 to 30 GHz to a millimeter wave region of 30 to 300 GHz. An electric wave application system using a millimeter electric wave, for example, a radar between vehicles has been put to practical use.

[0006] As an example of electric components using such high frequencies, a wiring substrate accommodating a plurality of chips in its one case is assumed.

[0007] FIG. 6 is a schematic sectional view for explaining the structure of such a wiring substrate 60. In FIG. 6, a metal case 61 a...

Claims

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