Conductive plastic compositions and method of manufacture thereof

a technology of conductive plastics and compositions, which is applied in the direction of transportation and packaging, special tyres, and non-conductive materials with dispersed conductive materials, etc. it can solve the problems of impact and surface finish of composite materials, less cost effective, and carbon fibers having diameters greater than 3 micrometers, so as to reduce the concentration of carbon fibers and achieve the same surface resistivity , the effect of reducing the concentration

Inactive Publication Date: 2003-09-25
AMARASEKERA JAYANTHA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] It has been unexpectedly found by the inventors hereof that an electrically conductive filler system comprising small carbon fibers and carbon powders, fibrous non-conductive fillers, or both, can be used to impart increased electrical conductivity to polymeric resins while maintaining properties such as impact strength, flexural modulus, shrinkage, class A finish, and the like in injection molded products. Small carbon fibers as defined herein may be either vapor grown carbon fibers or carbon nanotubes or a combination of both. In particular, it has been found that by adding either carbon powder or glass fibers or a combination of both with small carbon fibers to a polymeric resin, the electrical conductivity of the composition and its advantageous physical properties are maintained, while the weight percent (wt %) of small carbon fibers in the composition is substantially reduced. For example, the small carbon fiber concentration can be reduced up to about 85 wt % by the addition of up to about 25 wt % carbon powder without significant loss of electrical conductivity.
[0038] Conductive compositions made in this manner can be used for a variety of useful applications where electromagnetic shielding, electrostatic dissipation and antistatic properties are necessary such as in IC chip trays, electronic packaging, automotive exterior body panel applications, computer housings etc. The addition of glass helps maintain dimensional stability and prevent warping in such applications.

Problems solved by technology

However, the incorporation of carbon fibers having diameters greater than about 3 micrometers is detrimental to other properties such as the impact and surface finish of the composite.
Metal powders and flakes greatly increase the specific gravity of polymeric compositions, making them less cost effective, while the use of carbon black can lead to components that exhibit sloughing.
However the high cost of VGCF / carbon nanotubes makes the development of improved, cheaper, conductive polymeric composites important.

Method used

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  • Conductive plastic compositions and method of manufacture thereof
  • Conductive plastic compositions and method of manufacture thereof
  • Conductive plastic compositions and method of manufacture thereof

Examples

Experimental program
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Effect test

example 2

[0041] Lexan (polycarbonate) resin from GE Plastics was blended in a 30 mm twin screw Werner and Pfleiderer extruder with polycarbonate masterbatch containing VGCF obtained from Hyperion Catalysis International. The VGCF are present in an amount of about 15 wt % in the masterbatch. The Lexan along with the VGCF masterbatch are fed into the extruder through at the throat. The glass is fed into the extruder through a side feeder. The temperature of the die was set at 315.degree. C. The extrudate was immediately quenched in a water bath and pelletized. The pellets were dried in an oven and injection molded into 4 inch diameter discs of 0.125" thickness on a 120 ton VanDorn injection molding machine. The surface resistivity was obtained using the Keithley Electrometer, high resistivity meter 6517A with the 8007 resistivity test fixture.

[0042] Table 2 shows measured surface resistivity for compositions 14-18, which contain no glass fibers, compositions 20-23, which contain 20 wt % glass ...

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Abstract

An improved, conductive, polymeric composition comprises a polymeric resin; an electrically conductive filler system comprising small carbon fibers and either carbon powder or fibrous non-conductive filler or a combination of both. The amount of the conductive filler system utilized is dependent upon the desired electrical conductivity (surface and volume conductivity or resistivity) while preferably preserving intrinsic properties of the polymeric resin such as impact, flex modulus, class A finish, and the like. The conductive articles made from these compositions can therefore be used for electromagnetic shielding, electrostatic dissipation or antistatic purposes in packaging, electronic components, housings for electronic components and automotive housings.

Description

[0001] This application is a Continuation of U.S. Ser. No. 09 / 683,069, filed Nov. 15, 2001, and claims priority to U.S. Provisional Application Serial No. 60 / 287,127 filed Apr. 27, 2001, the entire contents of which are incorporated herein by reference.[0002] Plastic (polymeric resin) is often the material of choice for components in electronic products such as computers, photocopiers, and the like because it offers design flexibility, cost-effective manufacturing, and light weight products. In order to function efficiently in such applications, normally insulating polymeric resin must be made electrically conductive to provide electromagnetic shielding, electrostatic dissipation or antistatic properties to such components.[0003] Polymeric resins are typically made conductive by incorporating electrically conductive fillers such as carbon fibers, metal powders or flakes, vapor grown carbon fibers, carbon nanotubes, carbon black, and the like. However, the incorporation of carbon fib...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08K5/00H01B1/24
CPCH01B1/24C08K5/00
Inventor AMARASEKERA, JAYANTHABALFOUR, KIMLIETZAU, CHRISTIAN
Owner AMARASEKERA JAYANTHA
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