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Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device

a technology of epoxy resin and latent catalyst, which is applied in the direction of solid-state devices, transportation and packaging, basic electric elements, etc., can solve the problems of increasing the viscosity of epoxy resin, poor flowability, and inability to solve conventional epoxy resin compositions, etc., to achieve good flowability, good curability, and good storability

Inactive Publication Date: 2005-04-07
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

Another object of the invention is to provide an epoxy resin composition of good curability, flowability and storability.
(b) It was found that, when the latent catalyst of such a type as described above is mixed with an epoxy resin composition, then the resulting epoxy resin composition satisfies good storability, good flowability and good curability at the same time.
The latent catalyst of the invention is extremely useful for epoxy resin curing acceleration, and when mixed in an epoxy resin composition, an epoxy resin composition that satisfies all of good flowability, good storability and good curability can be obtained.

Problems solved by technology

Accordingly, there have occurred some problems that could not be solved by conventional epoxy resin compositions.
The increased molecular weight thereof causes an increase in the resin viscosity, and, as a result, the resin composition that contains a large amount of a filler for reliability improvement may be problematic in that its flowability is poor and therefore its moldability is also poor.
However, since such ordinary salts contain the suppressing component therein all the time from the initial stage to the end stage of curing reaction, they could not attain sufficient curability though could attain flowability.
That is, conventional latent catalysts could not satisfy both the two necessary requirements of flowability and curability at the same time.

Method used

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  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

example 1

Biphenyl-type epoxy resin (YX-4000HK manufacture by Japan Epoxy Resins Co., Ltd.) of the formula (16) shown below as the compound (A); phenolaralkyl resin (XLC-LL manufactured by Mitsui Chemicals Corp.) of the formula (17) shown below (in which the number of repetitive units of 3 is a mean value) as the compound (B); the compound C1 as the latent catalyst (C); fused spherical silica (having a mean particle size of 15 μm) as the inorganic filler (D); carbon black, bromobisphenol A-type epoxy resin and carnauba wax as the other additives were prepared.

Physical Data of Compound of Formula (16)Melting point:105° C.Epoxy equivalent:193ICI melt viscosity at 150° C.:0.15poises

Physical Data of Compound of Formula (17)Softening point:77° C.Hydroxyl equivalent:172ICI melt viscosity at 150° C.:3.6poises

Next, 52 parts by weight of the biphenyl-type epoxy resin, 48 parts by weight of the phenolaralkyl resin, 3.13 parts by weight of the compound C1, 730 parts by weight of fused spherical sili...

example 2

Biphenylaralkyl-type epoxy resin (NC-3000P manufactured by Nippon Kayaku Co., Ltd.) of the formula (18) shown below (in which the number of repetitive units of 3 is a mean value) as the compound (A); biphenylaralkyl-type phenol resin (MEH-7851SS manufactured by Meiwa Kasei K. K.) of the formula (19) shown below (in which the number of repetitive units of 3 is a mean value) as the compound (B); the compound C1 as the latent catalyst (C); fused spherical silica (having a mean particle size of 15 μm) as the inorganic filler (D); carbon black, bromobisphenol A-type epoxy resin and carnauba wax as the other additives were prepared.

Physical Data of Compound of Formula (18)Melting point:60° C.Epoxy equivalent:272ICI melt viscosity at 150° C.:1.3poises

Physical Data of Compound of Formula (19)Softening point:68° C.Hydroxyl equivalent:199ICI melt viscosity at 150° C.:0.9poises

Next, 57 parts by weight of the biphenylaralkyl-type epoxy resin, 43 parts by weight of the biphenylaralkyl-type p...

example 3

An epoxy resin composition (thermosetting resin composition) was prepared in the same manner as in Example 1 except that 3.64 parts by weight of the compound C2 was used in place of the compound C1. Using the epoxy resin composition, packages (semiconductor device) were manufactured in the same manner as in Example 1.

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Abstract

The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

Description

FIELD OF THE INVENTION The present invention relates to a latent catalyst for epoxy resin, an epoxy resin composition, and a semiconductor device. BACKGROUND OF THE INVENTION For a method of producing semiconductor devices by encapsulating semiconductor chips, such as IC or LSI, transfer molding with an epoxy resin composition is suitable as it is inexpensive and applicable to industrial mass production of the devices, and is widely employed in the art. The properties and the reliability of semiconductor devices are being improved by improving epoxy resin and its curing agent, phenolic resin. However, with the recent market tendency toward small-sized, lightweight and high-performance electronic appliances, the degree of integration of semiconductors for such appliances is increasing year by year, and surface mounting of semiconductor devices is promoted. Given that situation, the prerequisites for the epoxy resin composition for use in encapsulating semiconductor chips are being...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08F4/636C08G59/68C08G59/18C08G59/20C08L63/00H01L23/29H01L23/31
CPCC08G59/18Y10T428/31511C08G59/68C08L63/00C08G59/686C08G59/688C08G59/226C08G59/621
Inventor HORIMOTO, AKIHIROGOH, YOSHIYUKI
Owner SUMITOMO BAKELITE CO LTD
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