Forming a semiconductor structure in manufacturing a semiconductor device using one or more epitaxial growth processes

Abstract

In one embodiment, a semiconductor structure used in manufacturing a semiconductor device includes a substrate layer. The structure also includes first and second isolation regions formed by etching an oxide layer provided on the substrate layer to define an epitaxial growth surface of the substrate layer for epitaxial growth of a substrate material on the epitaxial growth surface between the first and second isolation regions. The structure also includes an active region that includes the epitaxially-grown substrate material between the first and second isolation regions, the active region formed by epitaxially growing the substrate material on the epitaxial growth surface of the substrate layer.

Description

TECHNICAL FIELD [0001] This invention relates generally to semiconductor structures, and more particularly to forming a semiconductor structure in manufacturing a semiconductor device using one or more epitaxial growth processes. BACKGROUND [0002] Integrated circuit fabrication often includes forming one or more isolation regions to define one or more active regions on a silicon or other substrate of a semiconductor structure. One way to form an isolation region is to form one or more trenches in the substrate using one or more etching processes while masking the substrate over what is to be the active region. As an example, this process may be referred to as shallow trench isolation (STI). Subsequent to formation, a liner oxide layer may be formed in the trenches and the trenches may be filled with a fill oxide to form the isolation regions. The etching processes for forming the isolation regions may lead to problems that may degrade transistor performance. These problems may inclu...

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Benefits of technology

[0005] According to the present invention, disadvantages and problems associated with previous techniques for forming semiconductor structures in manufacturing semiconductor devices may be reduced or eliminated.

Problems solved by technology

Furthermore, in certain embodiments, previous STI etch and fill techniques for forming the isolation regions may involve etching a trench for each isolation region and introducing a liner oxide layer in each of the trenches, which may lead to undesirable stress in the semiconductor structure.

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