Child-resistant blister package

a blister package and child-resistant technology, applied in the field of blister packaging, can solve the problems of difficult peeling, poor puncture resistance of paper-film laminates and paper-film-foil laminates, and difficulty in initiating a new peeling,

Inactive Publication Date: 2005-06-30
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One challenge in the manufacture of blister packaging is to make a package that is child resistant that can also be opened by an adult without undue difficulty.
One disadvantage of current peel off-push through packages is that paper-film-foil laminates used in the lidding do not generally peel cleanly in one piece and often tear at the perforation, making it difficult to initiate a new peel.
Some paper-film laminates and paper-film-foil laminates also have poor puncture resistance and can be chewed through by a child.
Another disadvantage of using paper-film laminates or paper-film-foil laminates in the lidding component is that it is not unusual to have problems with moisture being sealed in the blister when moisture that is retained in the paper forms steam at the high temperatures used in the heat-sealing-process.
The Tyvek® nonwoven material is breathable and therefore such packaging is not suitable for packaging pharmaceuticals and other materials that are oxygen or moisture sensitive.

Method used

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Examples

Experimental program
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Effect test

example 1

[0061] This example demonstrates preparation of a blister package comprising a lidding component according to FIG. 2a, wherein the nonwoven layer was a smooth-calendered full-surface bonded spunbond nonwoven web and the barrier layer in the lidding was a metal foil.

[0062] A spunbond bicomponent nonwoven web was prepared in which the fibers were continuous core / sheath fibers having a poly(ethylene terephthalate) (PET) core component and a co-polyester sheath component composed of 17 mole percent modified di-methyl isophthalate PET copolymer.

[0063] The thermally calendered bicomponent spunbond web was then laminated to a 0.93 mil (0.024 mm) thick soft-tempered aluminum foil obtained from Alcoa (Pittsburgh, Pa.) using Adcote 503 A / Cat F solvent-based poly(ethylene terephthalate)-based polyurethane permanent adhesive tie layer obtained from Rohm & Haas (Philadelphia, Pa.). An Inta-Roto dry-bond coater / laminator (Model ‘The Delaware’) was used to perform the lamination. The Adcote 503A...

example 2

[0067] This example demonstrates preparation of a lidding component comprising a flash spun plexifilamentary sheet and a metalized polyester film suitable for use in peel-open child-resistant blister packages.

[0068] A multi-layer laminated sheet was prepared using an extrusion lamination process with an Egan Coater / Laminator. First, a permanent adhesive tie layer was used to bond a layer of Tyvek® flash spun high density polyethylene sheet (Tyvek® 1073D, basis weight 74.6 g / m2, available from E.I. du Pont de Nemours and Company (Wilmington, Del.)) to a metalized poly(ethylene terephthalate) film (Mylar® 7100 metalized (aluminum) film having a thickness of 12 microns, available from DuPont-Teijin Films). The permanent adhesive tie layer was Nucrel® 1214 ethylene methyl acrylate resin. The Nucrel® 1214 resin was extruded between the nonwoven and film substrates by extruding onto the metalized side of the Mylar® polyester film at a thickness of 0.5 mil and subsequently contacting the ...

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Abstract

An improved child-resistant blister package is provided in which the lidding component includes a tear-resistant nonwoven layer and a barrier layer. The nonwoven layer can be a melt-spun continuous filament nonwoven web or a flash spun plexifilamentary sheet. The lidding component used in peel off-push through blister packages of the invention contains fewer layers and has improved puncture resistance compared to lidding components used in child-resistant packages known in the art. In addition, in peel off-push through and peel-open package designs of the present invention, the lidding peels more cleanly from the blister component compared to packages known in the art which have a tendency to tear during peeling.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to improved child-resistant blister packaging. More particularly, this invention relates to blister packaging that includes a lidding component that comprises at least one nonwoven layer selected from the group consisting of melt-spun continuous filament nonwoven sheets and flash spun plexifilamentary sheets. [0002] Blister packages are known in the art, for example as packaging for pharmaceuticals and other materials. Blister packages include a blister component having at least one cavity formed therein into which the medicine or other packaged material is placed prior to being sealed to a lidding or top web component. Blister components known in the art include soft-tempered aluminum foils, hard-tempered aluminum foils, multi-layer cold formable foils, and thermoformed films. Lidding components known in the art include films, and combinations of films, paper, and / or foil. The lidding component generally has a heat-se...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B3/28B32B27/12B65D75/32B65D75/34B65D75/36
CPCB32B3/28B32B27/12B65D2575/3236B65D2215/04B65D75/327B32B7/06B32B15/08B32B2307/31B32B2439/80B32B27/304B32B2255/205B32B3/30B32B2255/10B32B7/12B32B2255/20B32B5/022B32B2439/00
Inventor MILLER, MARK RALPHTRIPLETT, EDITH GOTTEMOLLER
Owner EI DU PONT DE NEMOURS & CO
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