Production methods for a leadframe and electronic devices

Abstract

A leadframe for semiconductor chips and electronic devices produced on the leadframe includes providing the leadframe with a basic substrate, on which are disposed external contact elements exhibiting a rivet-shaped cross-section with a rivet head region, a rivet shank region, and a rivet foot region, as a result of which, the external contact elements are securely anchored in the housing made of a plastics compound.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This is a divisional application of application Ser. No. 10 / 330,440, filed Dec. 27, 2002; which was a continuing application, under 35 U.S.C. §120, of International application PCT / DE01 / 02097, filed Jun. 7, 2001; the application also claims the priority, under 35 U.S.C. §119, of German patent application DE 100 31 204.7, filed Jun. 27, 2000; the prior applications are herewith incorporated by reference in their entirety.FIELD OF THE INVENTION [0002] The invention relates to production methods for a leadframe and electronic devices. [0003] Leadframes for semiconductor chips for packing the semiconductor chips to form electronic devices in housings made of a plastics compound have to satisfy high reliability despite their mass production. This is true particularly if the leadframe is to be used to produce housings from which no flat conductors whatsoever protrude as terminal pins or terminal legs and, in the case of which, the housing mad...

AI Technical Summary

Benefits of technology

[0006] In accordance with another feature of the invention, the basic substrate has an electrically conductive surface, which has the advantage that, for the construction of external contact elements on the basic substrate, it is possible to apply an electrical voltage to the electrically conductive surface.

[0048] In accordance with again a further mode of the invention, the production of connections between contact areas of the semiconductor chip and the external contact elements is effected by bonding wire technology using bonding wires. To that end, the contact areas of the semiconductor chip are connected to the head region of the external contact elements through the bonding wires. During the subsequent potting with a plastics or synthetic resin compound, not only are the bonding wires enclosed in an outstanding manner by the plastics or synthetic resin compound, but the external contact element is also anchored securely in the plastics compound by virtue of its rivet-shaped cross-section. At the same time as the external contact elements, a metallic base can be deposited on the leadframe, onto which base the semiconductor chip can be soldered or adhesively bonded. This has the advantage, on one hand, that the semiconductor chip is supported by a metallic base, and the advantage, on the other hand, that the semiconductor underside has a large-area external contact by virtue of the metallic base.

Problems solved by technology

In such a case, there is the risk that, during the production or during the operation of the electronic device, the external contact elements will become detached from the plastics compound and the electronic device will, thus, become unusable.

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