Nickel electroplating bath designed to replace monovalent copper strike solutions

a technology of nickel electroplating and monovalent copper, which is applied in the field of nickel electroplating bath designed to replace monovalent copper strike solutions, can solve the problems of inconvenient plated layer subsequent plated layers, deficient adhesion of processes, and compromise of adhesion integrity between copper and zinc substrates

a technology of nickel electroplating and monovalent copper, which is applied in the field of nickel electroplating bath designed to replace monovalent copper strike solutions, can solve the problems of inconvenient plated layer subsequent plated layers, deficient adhesion of processes, and compromise of adhesion integrity between copper and zinc substrates

US20060096868A1Inactive Publication Date: 2006-05-11MACDERMID INC
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Examples

Experimental program
Comparison scheme
Effect test

examples

[0026] In the following examples, a zinc-plated steel panel was plated in a hull cell containing 267 ml of nickel plating solution, prepared as stated. The panel was plated at 1 Amp for ten minutes. The thickness of the deposit was measured by x-ray fluorescence spectroscopy. Adherence was checked by heating the plated article to a temperature of 160° C. for one hour and then plunging it into cold water at a temperature of approximately 10° C. Lack of adhesion was evident when blistering, cracking and peeling of the deposit was observed on contact with the cold water.

example 1

[0028]

Bath CompositionNickel sulfate hexahydrate150g / LSodium chloride20g / LBoric acid20g / LSodium sulfate anhydrous15g / L4-acetomido-5-hydroxy-2,7-napthalene-0.5g / Ldisulphonic acid-disodium salt4-hydroxy-methoxyphenolglycol sulphate0.6g / Lpotassium salt4,4′-sulphonyldiphenol0.4g / LTolylacetic acid0.6g / LMeasurement Test Results4 Asd2 Asd0.5 Asd7.68 μm4.56 μm1.79 μmAppearance and AdhesionEven matte coverage of nickel deposit between 0.75 Asd and 6 Asd.Good adhesion over current density range.

example 2

[0029]

Bath CompositionNickel sulfate hexahydrate280g / LSodium chloride20g / LSuccinic acid15g / LSodium sulfate anhydrous20g / L4-acetomido-5-hydroxy-2,7-napthalene-0.5g / Ldisulphonic acid-disodium salt4-hydroxy-methoxyphenolglycol sulphate0.6g / Lpotassium saltHydroxybenzoic acid1g / LTolylacetic acid0.2g / LMeasurement Test Results4 Asd2 Asd0.5 Asd7.32 μm4.37 μm1.18 μmAppearance and AdhesionEven bright deposit between 0.5 Asd and 6.5 Asd adhesion good on allcurrent densities observed.

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Abstract

A nickel electroplating bath is disclosed which is suitable for plating, a base layer of nickel over zinc or zinc alloy parts. Subsequent plating onto this base layer can be achieved with copper, chromium or bright nickel with good adhesion and appearance. The nickel electroplating solution proposed comprises an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.

Description

FIELD OF THE INVENTION [0001] This invention details a process, which can be used to electroplate a nickel deposit directly onto zinc or zinc alloy die-castings, thereby eliminating the need to use traditional cyanide based plating baths. BACKGROUND OF THE INVENTION [0002] Zinc parts are often produced as zinc based die-castings. It is common for these to be plated with other metals to improve cosmetic appearance and improve corrosion resistance. This coating generally consists of one or more of the following: copper, nickel, chromium, tin and brass. Traditionally these articles are base plated with a thin layer of monovalent copper from a copper cyanide bath. Because of the toxicity of cyanide and it's impact on the environment and hence, expense of treatment and disposal—it is desirable that an alternative plating solution be found. [0003] There are a number of cyanide-free copper electroplating processes detailed in the literature. For example, U.S. Pat. No. 4,521,282 to Tremmel ...

Claims

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Application Information

Patent Timeline
11 May 2006
Publication
US20060096868A1
IPC
C25D5/10; C25D3/12
CPC
C25D3/12; C25D5/12; C25D5/627
Inventors
BUNCE, SIONA; LONG, ERNEST