Cooling device of thin plate type for preventing dry-out

Abstract

The present invention provides a thin plate type cooling device including at least one cavity formed on an inside wall of coolant circulation loop in order to prevent dry-out of the coolant.

Description

TECHNICAL FIELD [0001] The present invention relates to a thin plate-type cooling device for cooling a semiconductor integrated circuit device, etc., and more particularly to a thin plate-type cooling device capable of preventing a coolant from drying out using the phase transition of operation fluid. BACKGROUND ART [0002] As design rules decrease due to the trend towards large scale integration of semiconductor devices, and thereby the line width of electronic devices constituting semiconductor devices narrows, small-sized and high performance electronic equipment has been achieved owing to a larger number of transistors per unit area, which causes, however, that the ratio of heat emission of a semiconductor device per unit area increases. The increase of the rate of heat emission deteriorates the performance of semiconductor devices and lessens the life expectancy thereof, and eventually decreases the reliability of a system adopting semiconductor devices. Particularly in semicond...

AI Technical Summary

Benefits of technology

"The present invention provides a thin plate-type cooling device for preventing the dry-out phenomenon in the evaporation section. The device includes a housing with a circulation loop of a fluid and a coolant that can change from one state to another. The coolant is filled in the housing through a capillary action and gasified by heat transferred from an external heat source. The device has a gaseous coolant transfer section with at least one cavity for containing the gaseous coolant, a liquefied coolant transfer section, and a thermal insulation section for insulating the evaporation section from at least a part of the liquefied coolant transfer section. The device improves cooling efficiency by improving the flow of the coolant."

Problems solved by technology

As design rules decrease due to the trend towards large scale integration of semiconductor devices, and thereby the line width of electronic devices constituting semiconductor devices narrows, small-sized and high performance electronic equipment has been achieved owing to a larger number of transistors per unit area, which causes, however, that the ratio of heat emission of a semiconductor device per unit area increases.

The increase of the rate of heat emission deteriorates the performance of semiconductor devices and lessens the life expectancy thereof, and eventually decreases the reliability of a system adopting semiconductor devices.

Particularly in semiconductor devices, parameters are too easily affected by operation temperatures, and thereby it further deteriorates the characteristics of integrated circuits.

The fin-fan type cooler which compulsorily cools devices using fins and / or fans has been used for tens of years, but has some defects such as noise, vibration, and low cooling efficiency as compared with its large volume.

Although the peltier type cooler doesn't make noise or vibration, it has a problem that it requires too many heat dissipation devices at its hot junction, needing large driving power due to its low efficiency.

The water-jet type cooler goes mainstream in cooling device research because of its excellent efficiency, but its structure is complicated due to the use of a thin film pump driven by an external power supply, and it is significantly affected by gravity, as well as a problem that it is difficult to achieve robust design when applied to personal mobile electronic equipment.

And there is a problem that its installation location is significantly restricted because the coolant gasified inside the pipe moves depending upon buoyancy and pressure difference, and the liquefied coolant in the heat pipe depends on gravity due to the structure and size of the medium of the returning section.

According to the thin plate-type cooling device disclosed, however, there is a possibility that the coolant in the gas state is not completely condensed in the condensation section and reaches the condensation section via the liquefied coolant transfer section and / or the coolant storage section, contained in the condensed coolant in the form of bubbles.

If the bubbles contained in the coolant in the liquid state reach the evaporation section, there is concern that the dry-out phenomenon by which the coolant in the liquid state is exhausted occurs in the evaporation section.

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