Precursor preparation for controlled deposition coatings

Abstract

We have devised an apparatus useful for and a method of removing impurities from vaporous precursor compositions used to generate reactive precursor vapors from which thin films / layers are formed under sub-atmospheric conditions. The method is particularly useful when the layer deposition apparatus provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the layer formation process, where the presence of impurities has a significant affect on both the quantity of reactants being charged and the overall composition of the reactant mixture from which the layer is deposited. The method is particularly useful when the vapor pressure of a liquid reactive precursor is less than about 250 Torr at atmospheric pressure.

Description

[0001] This application is related to application Ser. No. 10 / 759,857, filed Jan. 17, 2004, published Dec. 30, 2004 as Publication No. US 2004 / 0261703 A1, and entitled: “Apparatus And Method For Controlled Application Of Reactive Vapors To Produce Thin Films And Coatings”, which is hereby incorporated by reference. This application is also related to a series of patent applications pertaining to deposition of specialized coatings, including: application Ser. No. 10 / 862,047, filed Jun. 4, 2004, and entitled: “Controlled Deposition Of Silicon-containing Coatings Adhered By An Oxide Layer”; application Ser. No. 10 / 912,656, filed Aug. 4, 2004, and entitled: “Vapor Deposited Functional Organic Coatings”; and, application Ser. No. 10 / 996,520, filed Nov. 19, 2004, and entitled: “Controlled Vapor Deposition Of Multi-layered Coatings Adhered By An Oxide Layer”. These related applications provide background for the present disclosure, and the content of these applications in hereby incorporat...

AI Technical Summary

Benefits of technology

[0016] We have devised an apparatus useful for and a method of removing impurities from liquid precursor materials used to generate reactive precursor vapors from which thin films and layers are formed on a substrate. The apparatus is easily integrated into the apparatus used in the layer deposition process. The method is particularly useful when the deposition process provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the layer formation process, where the presence of impurities has a significant effect on both the quantity of reactant being charged and the overall composition of the reactant from which the layer is generated.

Problems solved by technology

Historically, these types of layers were deposited from a liquid phase, resulting in limited film property control and loss of device yield due to capillary forces.

The design of the vapor-liquid separators described above is relatively complicated, which is due at least in part to the need to have a continuous flow of liquid to a downstream process.

As a result, when a given amount of reactive vapor is charged to a processing chamber in which the coating is formed on a substrate, due to the impurity content of the vapor, there may not be sufficient reactant to produce full coverage of the substrate surface by the deposited layer.

Further, the impurities may affect the chemical composition and physical properties of the deposited layer.

This increases the problem of the presence of impurities in the precursors, which impurities become part of the vapor produced from the precursors.

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