Method for making guide panel for vertical probe card in batch

Abstract

A method for making a guide panel for a vertical probe card in batch includes the steps of a) preparing a non-metal substrate, b) forming a shielding layer having a plurality of openings on the substrate, c) etching a part of the substrate corresponding to the openings of the shielding layer by an anisotropic etching so as to form bind holes with a predetermined depth on the substrate, d) grinding the substrate to open the blind holes by a back side thinning technology so as to form micro feed through holes on the substrate, and e) removing the shielding layer so as to obtain the desired guide panel.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a guide panel for use in a vertical probe card and more specifically, to a method for making the guide panel in batch. [0003] 2. Description of the Related Art [0004] As shown in FIG. 1, a vertical probe card 1 for testing properties of an electronic component comprises multiple guide panels 2, which have respectively a plurality of micro feed through holes 3 for the insertion of vertical probe pins 4 respectively to guide movement of the inserted vertical probe pins 4 along an axial direction of the through holes 3 and to prohibit the inserted vertical probe pins 4 from sideway displacement, thereby achieving probing the circuits of electronic component 5 under test. [0005] Various guide panels for vertical probe cards have been disclosed. Exemplars are seen in U.S. Pat. Nos. 6,417,684; 6,297,657B1 and 6,404,211. According to U.S. Pat. No. 6,417,684, entitled “Securement of test poi...

AI Technical Summary

Benefits of technology

[0006] The present invention has been accomplished under the circumstances in view. It is the primary objective of the present invention to provide a guide panel fabrication method, which is able to make guide panels in batch, thereby saving much manufacturing time and lowering much manufacturing cost.

Problems solved by technology

According to this conventional processing technique, there is a limitation on the position precision of micro feed through holes and the pitch between micro feed through holes (micro feed through hole position error will be greater than 15 μm; micro feed through hole pitch will be greater than 25 μm).

Further, the manufacturing cost will be relatively increased subject to the number of the micro feed through holes to be made.

This method does not meet modem technology requirements.

However, using this laser processing technique to make the designed micro feed through holes one after another is complicated.

The manufacturing cost and time are relatively increased subject to the number of the micro feed through holes to be made.

However, because etching technology cannot make micro feed through holes of high depth-to-diameter ratio, multiple metal layers must be stacked so that micro feed through holes of desired depth can be obtained.

This fabrication method is complicated.

Further, much time is wasted in stacking metal layers.

Further, it is difficult to control levelling of stacked metal layers.

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