Semiconductor Module with Serial Bus Connection to Multiple Dies

Abstract

The semiconductor module includes a heat spreader, first and second sets of two semiconductors that include circuitry and are thermally coupled to the heat spreader, first and second termination resistors, and first and second sets of electrically conductive leads. The first termination resistor is coupled to the circuitry at the first set of semiconductors, while the second termination resistor is coupled to the circuitry of the second set of semiconductors. The first set of leads connect to the first set of semiconductors and has at least one lead that is common to both of the semiconductors of the first set of semiconductors. The second set of leads connect to the second set of semiconductors and has at least one lead that is common to both of the semiconductors of the second set of semiconductors.

Description

[0001] This application claims priority to and is a continuation of U.S. Ser. No. 11 / 398,458 filed on Feb. 7, 2002 entitled “Semiconductor Module With Serial Bus Connection To Multiple Dies”, which is a reissue of U.S. Pat. No. 6,833,984, which is a continuation in part of U.S. Ser. No. 09 / 564,064 filed on May 3, 2000 entitled “Semiconductor Module with Imbedded Heat Spreader”, all of which are incorporated by reference herein in their entirety.TECHNICAL FIELD [0002] The present invention relates generally to semiconductor modules and in particular to a semiconductor module that allows for more efficient interconnection between the semiconductor module and a computing device's transmission channel. BACKGROUND OF THE INVENTION [0003] The semiconductor industry is constantly producing smaller and more complex semiconductors, sometimes called integrated circuits or chips. This trend has brought about the need for smaller chip packages with smaller footprints, higher lead counts, and be...

AI Technical Summary

Benefits of technology

"The patent describes a semiconductor module that includes a heat spreader, semiconductors, and electrically conductive leads. The module also includes a termination resistor that reduces signal degradation and the need for a separate termination resistor on the circuit board. The technical effects of this invention include improved signal quality, reduced circuit board space requirements, and lower costs."

Problems solved by technology

A problem with in-line memory modules is that adding more chips to the circuit board spreads out the placement of the chips on the circuit card and therefore requires reconfiguration of the circuit card connectors and their associated connections on the motherboard, which means replacing the memory card and in some cases the motherboard.

Another problem with current in-line memory modules is that a separate heat spreader must be positioned across a set of memory chips.

The heat spreader adds cost to the assembly process and adds significant weight to the module.

However, each successive electrical lead slightly degrades the signal, by placing a load on the signal.

The longer the electrical lead, the more the signal degradation.

Therefore, existing MCMs can only handle a maximum of approximately thirty two semiconductors connected to a single transmission channel before the signal has degraded to an unusable form.

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