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Process for producing an article with a coating of electrically conductive polymer

a technology of electrically conductive polymer and coating, which is applied in the direction of ceramic shaping apparatus, special surfaces, electric devices, etc., can solve the problems of coating of printed circuit boards, particular practical technical disadvantages, and adverse effects on use properties, so as to prevent the loss of solderability of copper or copper alloy during storage, and effectively protect against oxidation

Inactive Publication Date: 2007-11-29
ORMECON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution effectively protects copper from oxidation and maintains solderability over time, allowing for multiple reflow processes without significant degradation, unlike conventional methods which lose solderability within months.

Problems solved by technology

Although copper is a semiprecious metal, this material is readily oxidizable, which often has an adverse effect on its use properties.
This manifests itself not only visually but also has in particular practical technical disadvantages.
Particular problems arise in the coating of printed circuit boards, which are then assembled in soldering processes, copper wires which are used as electrical conductors, or copper pipes.
Finely divided copper powders are practically impossible to produce and use without oxidation protection.
Thus formulations with imidazoles or benzimidazoles often contain formic acid and sometimes other organic acids which smell unpleasant, are corrosive and have toxicological disadvantages.
In addition, the thermal stability is low.
Coatings with gold are expensive not only on account of the high gold price, but in addition require special processes for the application of the gold layer.
For example, gold cannot chemically be applied in so-called horizontal plants but only in vertical plants, which results in additional high process costs.
The application of silver is poorly reproducible, and the necessary plants are difficult to regulate.
It is pointed out that the application of the conductive polymer alone does not guarantee adequate corrosion protection, and the metallic material is therefore preferably provided with a corrosion-protecting coating after the passivation.

Method used

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  • Process for producing an article with a coating of electrically conductive polymer
  • Process for producing an article with a coating of electrically conductive polymer

Examples

Experimental program
Comparison scheme
Effect test

embodiments

EXAMPLES 1 TO 2

Production of Coated Printed Circuit Boards

[0052] Epoxy resin composite printed circuit boards 10 were cleaned and degreased using a normal commercial cleaner based on sulphuric acid and citric acid (ACL 7001, Ormecon GmbH) in a cleaning bath for 2 minutes at 45° C. The printed circuit boards had a test design 12 (see FIG. 1), which has been agreed with test institutes and printed circuit board manufacturers and is modelled on real printed circuit board structures. These boards enable the solderability to be measured and assessed. Next, the printed circuit boards 10 were rinsed with tap-water at room temperature and then treated with an H2O2-containing etching solution (Etch 7000, Ormecon GmbH) for 2 minutes at 30° C. After etching, the boards were again rinsed with tap-water at room temperature and then coated with the conductive organic polymers listed in Table 1. For this, the boards were immersed in an aqueous dispersion of the polymer in question at room temper...

examples 3 and 4

Production of Coated Printed Circuit Boards (Comparison)

[0054] Analogously to Examples 1 to 2, printed circuit boards were coated with normal commercial agents based on benzotriazole in accordance with the respective use instructions (Glicoat Tough Ace F2 (LX); Shikoku Co., Japan, Example 3 and Entek Plus Cu 106 A, Enthone OMI Co., Netherlands, Example 4).

example 5

Soldering Angle Measurement

[0055] Some of the printed circuit boards 10 produced in Examples 1 to 4 were subjected to an accelerated ageing process, in that some boards were stored for 1 hour at 100° C. and others for 4 hours at 144° C. The soldering angle (wetting angle: according to the Standard NF A 89 400 P or ANSI-J-STD 003 I.E.C. 68-2-69) of the freshly prepared boards and those aged at 100° C. or 144° C. were determined with a normal commercial meniscograph (Type ST 60, Metronelec Co.). The device measures the wetting force against time and converts this to soldering angles by normal procedures (see manual). In each case, the soldering angle was measured with no reflow cycle, and after 2 and after 3 reflow cycles. The reflow cycles serve for the simulation of repeated soldering operations and were effected in an HA 06 Hot-Air / Quartz Reflow Oven (C.I.F. / Athelec Co., France), which by means of temperature profiles simulates multiple soldering.

[0056] The results of the solderi...

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Abstract

A process for producing a coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and / or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer (iii) containing the conductive polymer.

Description

RELATED APPLICATION DATA [0001] This application is a divisional of U.S. patent application Ser. No. 11 / 165,411, filed Jun. 23, 2005, entitled ARTICLE WITH A COATING OF ELECTRICALLY CONDUCTIVE POLYMER AND PROCESS FOR PRODUCTION THEREOF, which application claims benefit of commonly assigned and copending German Patent Application Serial Number 10 2004 030 388.6, filed Jun. 23, 2004, entitled ARTICLE WITH A COATING OF ELECTRICALLY CONDUCTIVE POLYMER AND PROCESS FOR PRODUCTION THEREOF, which applications are incorporated herein in their entirety by reference.TECHNICAL FIELD [0002] The present invention concerns the production of coated articles which contain a layer of copper or a copper alloy and a layer of an electrically conductive polymer and which are particularly suitable as printed circuit boards or for the production of printed circuit boards. BACKGROUND ART [0003] Copper is one of the most widely used metallic materials of our time. Although copper is a semiprecious metal, thi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B05D5/12B28B19/00C23C30/00H01C17/06B23K1/20B23K35/36C09D5/08C09D5/24C09D179/02H05K3/28
CPCC09D5/24H05K3/282H05K2201/0329Y10T428/265Y10T428/26Y10T428/12882Y10T428/12903Y10T428/31678Y10T428/31681
Inventor WESSLING, BERNHARD
Owner ORMECON