Apparatus and methods for handling materials in a 3-D printer
a technology of 3d printers and apparatuses, applied in the field of 3d printers, can solve the problems of affecting the operation of the printhead, no binder material being dispensed or inaccurately dispensed, powder handling and powder and dust management, etc., and achieve the effect of reducing the contamination of the printer and surrounding area from escaped or spilled powder, improving the efficiency of the 3d printing system, and reducing the amount of waste generated
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0064] The systems and components described herein can be used with various 3D printers and related apparatus, such as those disclosed in U.S. Pat. No. 5,902,441, U.S. Pat. No. 6,007,318, U.S. Patent Application No. 2002 / 0079601, U.S. Patent Application No. 2004 / 0012112, U.S. Patent Application No. 2004 / 0265413, U.S. Patent Application No. 2005 / 0280185, U.S. Patent Application No. 2006 / 0061613, and U.S. Patent Application No. 2006 / 0061318, the entire disclosures of which are hereby incorporated herein by reference.
[0065] In one embodiment of the invention, a pneumatic means of handling powder is provided, allowing the powder to be transferred from one location to another within the 3D printer system automatically and quickly with minimal or substantially no loss of powder or contamination of the printer and / or surrounding environment. A schematic diagram showing elements of this configuration can be seen in FIG. 1.
[0066]FIG. 1 shows a powder handling system 100 for a 3D printer. T...
PUM
Property | Measurement | Unit |
---|---|---|
volume | aaaaa | aaaaa |
distance | aaaaa | aaaaa |
power | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com