Low-melting point superabrasive tools and associated methods

a superabrasive tool and low-melting point technology, applied in the direction of grinding device, abrasive surface conditioning device, metal-working apparatus, etc., can solve the problems of abrasive slurry, abrasive dust coming from workpieces, and the accumulation of polishing debris coming from workpieces, so as to achieve the effect of improving the wetting and low-melting poin
US20080096479A1Inactive Publication Date: 2008-04-24SUNG CHIEN MIN
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Patent Information

Authority / Receiving Office
US Ā· United States
Current Assignee / Owner
SUNG CHIEN MIN
Publication Date
2008-04-24
Estimated Expiration
Not applicable Ā· inactive patent

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Abstract

Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method for making a low-melting point superabrasive tool having a plurality of superabrasive particles is provided. Such a method may include coating each of the plurality of superabrasive particles with a reactive element that chemically bonds to each of the plurality of superabrasive particles and bonding together the plurality of superabrasive particles with a molten braze that wets the reactive element at a temperature of less than about 700Ā° C. In some aspects, the method may further include arranging the plurality of superabrasive particles on a leveling surface and bonding the plurality of superabrasive particles together with the molten braze such that, upon formation of the superabrasive tool, the plurality of superabrasive particles have been leveled by the leveling surface to an RA value of less than about 40 Ī¼m.
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Description

FIELD OF THE INVENTION

[0001] The present invention relates generally to tools having superabrasive particles embedded in a support matrix having a low-melting point and associated methods. Accordingly, the present invention involves the chemical and material science fields.BACKGROUND OF THE INVENTION

[0002] Many industries utilize a chemical mechanical polishing (CMP) process for polishing certain work pieces. Particularly, the computer manufacturing industry relies heavily on CMP processes for polishing wafers of ceramics, silicon, glass, quartz, and metals. Such polishing processes generally entail applying the wafer against a rotating pad made from a durable organic substance such as polyurethane. A chemical slurry is utilized that contains a chemical capable of breaking down the wafer substance and an amount of abrasive particles which act to physically erode the wafer surface. The slurry is continually added to the rotating CMP pad, and the dual chemical and mechanical forces exer...

Claims

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