Method of manufacturing a cold plate heat exchanger assembly having a metallic compliant gasket
a technology of cold plate heat exchanger and compliant gasket, which is applied in the direction of lighting and heating apparatus, semiconductor/solid-state device details, soldering apparatus, etc., can solve the problems of microscopic casting layer and inability to see without magnification, and achieves convenient intimate contact, simple manufacturing process, and increased thermal performance
Inactive Publication Date: 2008-12-11
DELPHI TECH INC
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Benefits of technology
[0013]One advantage of the present invention is that it utilizes the vapor-deposited copper particulate that is a natural by-product of the laser machining process used in the formation of the micro-channels to form a compliant gasket that facilitates the intimate contact between the micro-channels and the manifold channels, thus preventing flow by-pass and increasing thermal performance.
[0014]Another advantage of the present invention is the elimination of the need to remove the recast layer prior to assembly; this, simplifies the manufacturing process and reduces cost.
[0015]Further features and advantages of the invention will appear more clearly on a reading of the following detailed description of the preferred embodiment of the invention, which is given by way of non-limiting example only and with reference to the accompanying drawings.
Problems solved by technology
The recast layer is microscopic and cannot be seen without magnification.
Method used
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[0026]In accordance with a preferred embodiment of this invention, referring to FIGS. 1 through 9, shown is an all-metal micro-channel cold plate assembly. The cold plate assembly utilizes what is normally an undesirable by-product of laser machining, a layer of recast metallic particulates, as a compliant gasket between the contact surfaces of the top edges of the base cold plate micro-fins and bottom surfaces of the manifold channels.
[0027]In reference to FIG. 2, shown is an exploded view of a preferred embodiment of the current invention, which is indicated generally at 20. The primary components of the cold plate assembly 20 are a base plate 100, a manifold cover 200, a manifold plate 300, and inlet / outlet pipes 400. Manifold plate 300 is shown as a separate component; however, manifold plate 300 may be manufactured as an integral part of the interior face 210 of manifold cover 200. All components are manufactured of a heat conducting metal, preferably pure substantially oxygen ...
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Abstract
The subject invention provides a method of manufacturing an all-metal cold plate heat exchanger assembly for removing excess heat from a heat generating electronic component. The cold plate assembly includes a base plate having micro-channels and associated micro-fins, a manifold plate having alternating channels, and a manifold cover, wherein the manifold plate cooperates with the micro-channels to form an engineered pathway for coolant flow. This method assures a tight interface sealing between the contact surfaces of the alternating channels of the manifold plate and the coplanar surfaces of the micro-fins that would prevent coolant by-pass flow, but without clogging or jeopardizing the flow through the micro-channels. This method utilizes a layer of recast metallic particulates, which is a natural by-product of laser machining, as a compliant gasket material between the coplanar edges of the alternating channels and the coplanar edges of the micro-fins.
Description
TECHNICAL FIELD OF INVENTION[0001]This invention relates to a method of manufacturing an all-metal cold plate heat exchanger assembly.BACKGROUND OF INVENTION[0002]Forced air-cooling is typically used to remove excess heat generated by computing processing units (CPUs); however, forced air-cooling alone is no longer sufficient to meet the cooling needs of increasingly faster and hotter CPUs. An alternate to forced air-cooling is a recirculating closed-loop liquid cooling system. Recirculating closed-loop liquid cooling systems are known for their higher efficiency and capacity for excess heat removal.[0003]A schematic of a typical recirculating closed-loop liquid cooling system for cooling a heat generating electronic component is shown in FIG. 1. Illustrated is a recirculating closed-loop liquid cooling system 10 that includes a reservoir tank 15, a coolant pump 22, a cold plate heat exchanger assembly 25, a radiator 35, and a fan 40. The cold plate heat exchanger assembly 25 is in ...
Claims
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Login to View More IPC IPC(8): B21D53/02
CPCB23K26/123Y10T29/4935B23K26/1411B23K26/34B23K26/367B23K26/381B23K26/4005B23K26/401B23K2201/14B23K2203/12B23P15/26B23P2700/10F28F3/048F28F3/12H01L21/4878H01L23/473B23K26/3206B23K26/3213B23K35/007B23K26/385H01L2924/0002B23K26/1405H01L2924/00B23K26/32B23K26/40B23K26/142B23K26/144B23K26/364B23K26/382B23K26/389B23K2101/14B23K2103/12B23K2103/50
Inventor ANDERSON, JR., RUSSELL CHARLESBARTEN, BRIAN LESLIEBENOIT, JOHNVETTER, STEPHAN MICHAEL
Owner DELPHI TECH INC