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Multilayer printed circuit board

a printed circuit board and multi-layer technology, applied in the direction of circuit optical details, optical elements, instruments, etc., can solve the problems of less design freedom and increased size of printed circuit boards

Inactive Publication Date: 2009-01-15
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, it has become necessary for optical connectors and photoelectric conversion elements and optical transceivers to be mounted on a printed circuit board, and in this case, it is necessary to secure a new space for mounting on a printed circuit board, causing a problem that the printed circuit board increases in size, and furthermore, connection with an optical fiber is required and the location in which this is mounted is limited to the periphery of an end portion of the printed circuit board, and as a result, a problem arises that there is less freedom in design.

Method used

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  • Multilayer printed circuit board
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Examples

Experimental program
Comparison scheme
Effect test

example 1

A. Manufacture of Resin Film for Insulating Layer

[0478]To 20 parts by weight of ethyldiglycol acetate and 20 parts by weight of solvent naphtha were added 30 parts by weight of bisphenol A-type epoxy resin (epoxy equivalent: 469, EPICOAT 1001 made by Yuka Shell Epoxy K.K.), 40 parts by weight of cresol novolak-type epoxy resin (epoxy equivalent: 215, EPICRON N-673 made by Dainippon Ink & Chemicals, Inc.) and 30 parts by weight of triazine structure-containing phenol novolak resin (phenolic hydroxide group equivalent: 120, PHENOLITE KA-7052 made by Dainippon Ink & Chemicals, Inc.) so as to be dissolved therein while being stirred under heat, and to this were further added 15 parts by weight of polybutadiene rubber with epoxidized terminals (DENAREX R-45EPT, made by Nagase Kasei Kogyo K.K.), 1.5 parts by weight of 2-phenyl-4,5-bis(hydroxymethyl) imidazole pulverized product, 2 parts by weight of fine pulverized silica and 0.5 parts by weight of silicone-based antifoamer, so that an ep...

example 2

1. Manufacture of Circuit Board A

[0521](1) A copper-clad multilayer board where copper foil of 18 μm was laminated on the two surfaces of an insulating substrate 10021 made of a glass epoxy resin or a BT (bismaleimide-triazine) resin having a thickness of 0.8 mm, and thus, surface conductor layers 10028 were formed, was used as a starting material (see FIG. 18(a)). First, holes were drilled in this copper-clad multilayer board and an electroless plating process was carried out, and in addition, holes 10009 were filled in with a resin composite 10030′, whereby conductor layers 10027′ which formed the wall surface of non-penetrating via holes were formed (see FIGS. 18(b) and 18(c)).

[0522]Here, as the resin composite, a resin composite gained by putting 100 parts by weight of a bisphenol F-type epoxy monomer (YL983U, made by Yuka Shell K.K., molecular weight: 310), 170 parts by weight of SiO2 particles in spherical form having an average particle diameter of 1.6 μm where the surface wa...

example 3

1. Manufacture of Circuit Board A

[0559](1) A circuit board A was manufactured in accordance with the same method as in Example 2.

2. Manufacture of Circuit Board B

[0560](2) A copper-clad multilayer board, where copper foil having a thickness of 18 μm was laminated on the two surfaces of an insulating substrate 10021 made of a glass epoxy resin or a BT (bismaleimide triazine) resin having a thickness of 0.8 mm so that surface conductor layers 10028 were formed, was used as a starting material (see FIG. 25(a)). First, holes were drilled in this copper-clad multilayer board, an electroless plating process was carried out, and holes 10009 were filled in with a resin composite, whereby conductor layers 10027′ which forms non-penetrating via holes on the wall surface thereof were formed (see FIGS. 25(b) and 25(c)).

[0561]Here, as the resin composite, the same resin composite as that used for the manufacture of circuit board A was used.

[0562](3) Next, an etching resist 10003 was formed on su...

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Abstract

The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation application of PCT / JP2005 / 018367 filed on Oct. 4, 2005, which claims priority of JP-A2004-308781 filed on Oct. 22, 2004. The contents of these applications are incorporated herein by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a multilayer printed circuit board which can be used for optical communications.[0004]2. Discussion of the Background[0005]In recent years, together with the expansion of high speed Internet networks, it has been suggested that optical communications be used in communication between trunk networks and terminal equipment (personal computers, mobile units, games and the like), communication between terminal equipments and communication within terminal equipment, in addition to communication within trunk networks.[0006]In trunk networks, increase in the speed of switching apparatuses, such as switching sy...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G02B6/12H05K1/00H01R12/04
CPCG02B6/4214G02B6/43H05K2201/09536H05K3/4602H05K3/4623H05K1/0274
Inventor ASAI, MOTOOKODAMA, HIROAKIYAMADA, KAZUHITO
Owner IBIDEN CO LTD
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