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Alkali-soluble resin and negative-type photosensitive resin composition comprising the same

Inactive Publication Date: 2010-08-05
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0021]The alkali-soluble resin of the present invention is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin of the present invention has a lower viscosity than a linear alkali-soluble resin having the same molecular weight. The negative-type photosensitive resin composition of the present invention comprises the alkali-soluble resin as a binder resin to effectively reduce the height of a stepped portion of a photoresist pattern in a small amount. Furthermore, the negative-type photosensitive resin composition of the present invention exhibits improved chemical resistance and good developability.

Problems solved by technology

However, the developability of the photosensitizing materials tends to be poor.
Recent issues encountered in the production of LCD color filter substrates are the formation of stepped portions of color patterns on black matrixes (BMs) and the use of large amounts of photoresists.
At this time, the stepped portion is insufficiently rubbed to cause a deterioration in the image quality (e.g., an increase in black luminance and a reduction in color contrast) of the LCD.
However, the former method has the disadvantage of poor sensitivity despite a substantial reduction in the viscosity of the composition.
According to the latter method, the composition may suffer from the disadvantages of poor chemical resistance and pattern peeling upon development.
Further, the height of the stepped portion can be reduced by lowering the acid value of a constituent binder resin, but this is undesirable in terms of developability.
In this case, an increase in the viscosity of the composition is inevitably caused to make the coating thick, resulting in color distortion.

Method used

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  • Alkali-soluble resin and negative-type photosensitive resin composition comprising the same
  • Alkali-soluble resin and negative-type photosensitive resin composition comprising the same

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

Synthesis of Alkali-Soluble Resin

[0088]17.46 g of methacrylic acid as an acid group-containing monomer and 32.54 g of benzyl methacrylate as a monomer capable of reacting with the acid group-containing monomer were allowed to react in the presence of AIBN as a reaction initiator. The reaction mixture was refluxed in propyleneglycol monomethylether acetate as a solvent with stirring and 2.75 g of trimethylolpropane trismercaptopropionate (TMMP) as a chain transfer agent was added thereto. The resulting mixture was allowed to react at 70° C. for 9 hours. 0.02 g of methoxyhydroquinone (MEHQ) as a thermal polymerization inhibitor was added to the reaction mixture. After the reaction temperature was raised to 110° C., 8.71 g of glycidyl methacrylate (GMA) was added in the presence of a catalyst. The mixture was reacted for 10 hours to prepare an alkali-soluble resin.

[0089]The alkali-soluble resin was found to have a weight average molecular weight of 10,600 g / mol on a polystyrene basis a...

synthesis example 2

Synthesis of Alkali-Soluble Resin

[0090]17.46 g of methacrylic acid as an acid group-containing monomer and 32.54 g of benzyl methacrylate as a monomer capable of reacting with the acid group-containing monomer were allowed to react in the presence of AIBN as a reaction initiator. The reaction mixture was refluxed propyleneglycol monomethylether acetate as a solvent with stirring and 3.00 g of pentaerythritol tetramercaptopropionate (PEMP) as a chain transfer agent was added thereto. The resulting mixture was allowed to react at 70° C. for 9 hours. 0.02 g of 4-methoxyhydroquinone(MEHQ) as a thermal polymerization inhibitor was added to the reaction mixture. After the reaction temperature was raised to 110° C., 8.71 g of glycidyl methacrylate(GMA) was added in the presence of a catalyst. The mixture was reacted for 10 hours to prepare an alkali-soluble resin.

[0091]The alkali-soluble resin was found to have a weight average molecular weight of 10,500 g / mol on a polystyrene basis as mea...

example 1

Preparation of Photosensitive Resin Composition

[0093]11 g of the alkali-soluble resin prepared in Synthesis Example 1, 50 g of a red pigment dispersion, 13 g of dipentaerythritol hexaacrylate (DPHA) as a polymerizable compound having ethylenically unsaturated bonds, and 2 g of a photopolymerization initiator(Irgacure-369, CIBA Geigy) were mixed in 24 g of propylene glycol monomethyl ether acetate (PGMEA) to prepare a photosensitive resin composition.

[0094]The photosensitive resin composition was found to have a viscosity of 5.8 cps.

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Abstract

An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.

Description

TECHNICAL FIELD[0001]The present invention relates to an alkali-soluble resin and a negative-type photo-sensitive resin composition comprising the alkali-soluble resin. More specifically, the present invention relates to a low-viscosity alkali-soluble resin that is prepared by radical polymerization of an acid group-containing monomer and a monomer polymerizable therewith in the presence of a polyfunctional thiol compound as a chain transfer agent, and a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin.BACKGROUND ART[0002]A negative-type photosensitive resin composition typically comprises an alkali-soluble resin, a polymerizable compound having at least one ethylenically unsaturated bond, a photopolymerization initiator and a solvent. The typical negative-type photo-sensitive resin composition is generally patterned by applying the resin composition to a substrate to form a film, irradiating a specific portion of the film with lig...

Claims

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Application Information

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IPC IPC(8): G03C1/00C08F120/18
CPCC08F2/38C08F120/18C08F220/06C08F220/10G03F7/027G03F7/0007G03F7/0382G03F7/033C08F222/00
Inventor KIM, HAN SOOKIM, SUNG HYUNPARK, KWANG HANLIM, MIN YOUNGHEO, YOON HEEYOO, JI HEUMKIM, SUN HWA
Owner LG CHEM LTD