Liquid-cooling heat sink and heat exchanger thereof

Inactive Publication Date: 2012-04-05
COOLER MASTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0024]According to the present invention, each of the heat-dissipating plates overlaps with adjacent one heat-dissipating plate in a head-to-tail manner, so that the two notches of each heat-dissipating plate form an intake notch channel and an exhaust notch channel respectively. The dividing strips form an intersecting structure on upper and lower sides of each through-hole respectively to thereby define a multi-direction sub-channel for allowing the cooling liquid to flow through. The cooling liquid flows from the intake notch channel into the multi-direction sub-channels and exits via the exhaust notch channel. Thus, after the cooling liquid flows into the notch of each heat-dissipating plate from the intake notch channel, the cooling liquid flow through the heat-dissipating plate and then through the gaps between the adjacent two overlapped heat-dissipating plates to thereby enter the adjacent through-holes. Since the dividing strips define an intersecting structure on upper and lower sides of each through-hole, the cooling liquid is guided by the intersecting structure to flow upwards, downwards, leftwards and rightwards into the multi-direction sub-channels in the through-holes of each h

Problems solved by technology

As a result, the performance of the electronic elements is deteriorated and thus their

Method used

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  • Liquid-cooling heat sink and heat exchanger thereof
  • Liquid-cooling heat sink and heat exchanger thereof
  • Liquid-cooling heat sink and heat exchanger thereof

Examples

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Example

[0041]Please refer to FIG. 1, which is an exploded perspective view showing the first embodiment of the present invention. The present invention provides a liquid-cooling heat sink 1, which includes a base 10, a cover 20, and a heat exchanger 30.

[0042]The base 10 is made of metallic materials having high heat conductivity such as aluminum, copper or the like. The base 10 can be formed into any suitable shape. In the first embodiment, the base 10 is formed into a flat disk. After the cover 20 covers the base 10, an accommodating space S is formed between the base 10 and the cover 20 for allowing a cooling liquid and the heat exchanger 30 to be disposed therein. As shown in FIG. 3, the bottom surface of the base 10 is brought into thermal contact with a heat source (not shown) to be cooled, thereby conducting the heat generated by the heat source to the heat exchanger 30.

[0043]The cover 20 is also made of metallic materials having high heat conductivity such as aluminum, copper or the...

Example

[0047]As shown in FIG. 2, in the second embodiment, each of the heat-dissipating plates 31 has a plurality of first dividing strips 311 and a plurality of second dividing strips 312 intersecting with the first dividing strips 311. It should be noted that, FIG. 2 shows that the first dividing strips 311 and the second dividing strips 312 perpendicularly intersect with each other to form a cross structure, which is a preferred embodiment. Of course, it can be contemplated that the first dividing strips 311 and the second dividing strips 312 may intersect with each other to form an X-shaped structure to achieve the same effect. Both ends of each heat-dissipating plate 31 are provided with a first notch 313 and a second notch 314 to correspond to the locations of the intake pipe 21 and the exhaust pipe 22 respectively. The first notch 313 and the second notch 314 are located at two opposite ends of each heat-dissipating plate 31. Both ends of each first dividing strips 311 correspond to...

Example

[0058]Please refer to FIGS. 12 to 14 showing the third embodiment of the present invention. Similar to the first embodiment, the base 10b in the third embodiment is formed into a plate, and the cover 20b is formed as a hollow cover. The cover 20b covers the base 10a to form an accommodating space S there between. A gasket 11b is disposed in a connecting portion between the base 10b and the cover 20b to prevent the leakage of the cooling liquid. Of course, it can be contemplated that the base 10b may be configured as a hollow cover and the cover 20 is formed into a plate.

[0059]In the third embodiment, each heat-dissipating plate 31b has a plurality of first dividing strips 311b and a plurality of second dividing strips 312b intersecting with the first dividing strips 311b. It should be noted that, in FIG. 12, the first dividing strips 311b and the second dividing strips 312b intersect with each other perpendicularly to form a cross structure, which is merely a preferred embodiment. O...

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Abstract

A liquid-cooling heat sink includes a base, a cover and a heat exchanger. The cover has an intake pipe and an exhaust pipe. The heat exchanger includes heat-dissipating plates overlapping with each other. Each heat-dissipating plate has dividing strips. Any two adjacent dividing strips define a through-hole. Both ends of each heat-dissipating plate are provided with a notch respectively. Each heat-dissipating plate overlaps with adjacent one heat-dissipating plate in a head-to-tail manner, so that the two notches of each heat-dissipating plate form an intake notch channel and an exhaust notch channel respectively. The dividing strips form an intersecting structure on upper and lower sides of each through-hole respectively to thereby define a multi-direction sub-channel. The cooling liquid flows from the intake notch channel into the multi-direction sub-channels and exits via the exhaust notch channel. In this way, the heat-exchanging efficiency and heat-dissipating effect are improved.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat sink, and in particular to a liquid-cooling heat sink and a heat exchanger thereof.[0003]2. Description of Prior Art[0004]With the rapid advancement of science and technology, the performance and power of electronic elements increase greatly, so that the amount of heat generated by the electronic elements also gets more and more. If the heat generated by the electronic elements is not dissipated to the outside, the heat will be accumulated in the electronic elements to cause the increase of their temperature. As a result, the performance of the electronic elements is deteriorated and thus their lifetime is shortened.[0005]Therefore, a heat sink is mounted in an electronic apparatus such as a computer host, a liquid crystal display, a television set, a plasma TV to dissipate its heat. At an early stage, a fan is often used as the heat sink. However, the heat-dissipating effect of t...

Claims

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Application Information

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IPC IPC(8): F28F9/00F28F7/00
CPCF28F3/086F28F3/12H01L23/473H01L2924/0002H01L2924/00
Inventor CHENG, CHIA-CHUN
Owner COOLER MASTER CO LTD
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