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Liquid-cooling heat sink and heat exchanger thereof

Inactive Publication Date: 2012-04-05
COOLER MASTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The present invention is to provide a liquid-cooling heat sink, which is capable of increasing the contact area and contact time between the heat exchanger and the cooling liquid, thereby increasing the heat-exchanging efficiency and heat-dissipating effect.
[0019]The present invention is to provide a heat exchanger of a liquid-cooling heat sink, which is capable of increasing the contact area and contact time between the heat exchanger and the cooling liquid, thereby increasing the heat-exchanging efficiency and heat-dissipating effect.
[0024]According to the present invention, each of the heat-dissipating plates overlaps with adjacent one heat-dissipating plate in a head-to-tail manner, so that the two notches of each heat-dissipating plate form an intake notch channel and an exhaust notch channel respectively. The dividing strips form an intersecting structure on upper and lower sides of each through-hole respectively to thereby define a multi-direction sub-channel for allowing the cooling liquid to flow through. The cooling liquid flows from the intake notch channel into the multi-direction sub-channels and exits via the exhaust notch channel. Thus, after the cooling liquid flows into the notch of each heat-dissipating plate from the intake notch channel, the cooling liquid flow through the heat-dissipating plate and then through the gaps between the adjacent two overlapped heat-dissipating plates to thereby enter the adjacent through-holes. Since the dividing strips define an intersecting structure on upper and lower sides of each through-hole, the cooling liquid is guided by the intersecting structure to flow upwards, downwards, leftwards and rightwards into the multi-direction sub-channels in the through-holes of each heat-dissipating plates. In this way, the contact area and contact time between the cooling liquid and the heat-dissipating plates are increased greatly, and the heat-dissipating effect of the heat sink is thus improved.
[0025]According to the above, each of the heat-dissipating plates overlaps with adjacent one heat-dissipating plate in a head-to-tail manner, so that the two notches of each heat-dissipating plate form an intake notch channel and an exhaust notch channel respectively. The cooling liquid flows from the intake notch channel into the multi-direction sub-channels and exits via the exhaust notch channel. Thus, the periphery of the heat exchanger is provided with the intake notch channel and the exhaust notch channel. As a result, the intake pipe and the exhaust pipe may not have to be provided on the top of the cover and may be provided on one side edge or both side edges of the cover. Therefore, the space occupied by the heat sink in the vertical direction is reduced, which shortens the thickness of the heat sink. Further, the positions of the intake pipe and the exhaust pipe can be changed based on practical demands, which makes the heat sink to have changeable spatial arrangements.

Problems solved by technology

As a result, the performance of the electronic elements is deteriorated and thus their lifetime is shortened.
However, the heat-dissipating effect of the fan is insufficient.

Method used

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  • Liquid-cooling heat sink and heat exchanger thereof
  • Liquid-cooling heat sink and heat exchanger thereof
  • Liquid-cooling heat sink and heat exchanger thereof

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0041]Please refer to FIG. 1, which is an exploded perspective view showing the present invention. The present invention provides a liquid-cooling heat sink 1, which includes a base 10, a cover 20, and a heat exchanger 30.

[0042]The base 10 is made of metallic materials having high heat conductivity such as aluminum, copper or the like. The base 10 can be formed into any suitable shape. In the first embodiment, the base 10 is formed into a flat disk. After the cover 20 covers the base 10, an accommodating space S is formed between the base 10 and the cover 20 for allowing a cooling liquid and the heat exchanger 30 to be disposed therein. As shown in FIG. 3, the bottom surface of the base 10 is brought into thermal contact with a heat source (not shown) to be cooled, thereby conducting the heat generated by the heat source to the heat exchanger 30.

[0043]The cover 20 is also made of metallic materials having high heat conductivity such as aluminum, copper or the like. The cover 20 is f...

third embodiment

[0059]In the third embodiment, each heat-dissipating plate 31b has a plurality of first dividing strips 311b and a plurality of second dividing strips 312b intersecting with the first dividing strips 311b. It should be noted that, in FIG. 12, the first dividing strips 311b and the second dividing strips 312b intersect with each other perpendicularly to form a cross structure, which is merely a preferred embodiment. Of course, it can be contemplated that, the first dividing strips 311b and the second dividing strips 312b may intersect with each other to form an X-shaped structure, which also achieves the same effect. One side of each heat-dissipating plate 31b is formed with a plurality of notches 313b in the direction of the first dividing strips 311b. Another side of each heat-dissipating plate 31b is formed with a plurality of notches 314b in the direction of the second dividing strips 312b. The adjacent two first dividing strips 311b and adjacent two second dividing strips 312b d...

second embodiment

[0064]Although the present invention has been described with reference to the above preferred embodiments, the profile of the heat-dissipating plate 31, 31′ and the shapes of the dividing strips 311, 311′ and the through-holes 315, 315′ can be changed in a manner equivalent to those of the above preferred embodiments. For example, in the second embodiment, the dividing strips 311a, 311a′ and the through-holes 315, 315a are formed into a curved shape with respect to the line connecting the first notch 313 and the second notch 314. However, the dividing strips 311a, 311a′ and the through-holes 315a, 315a′ may be arranged to be parallel to or inclined with respect to the line connecting the first notch 313 and the second notch 314 as long as the dividing strips 311a, 311a′ intersect with each other to divide the through-holes 315a, 315a′ of the lower heat-dissipating plate 31a, 31a′ into a plurality of multi-direction sub-channels.

[0065]In the first embodiment and the second embodiment...

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Abstract

A liquid-cooling heat sink includes a base, a cover and a heat exchanger. The cover has an intake pipe and an exhaust pipe. The heat exchanger includes heat-dissipating plates overlapping with each other. Each heat-dissipating plate has dividing strips. Any two adjacent dividing strips define a through-hole. Both ends of each heat-dissipating plate are provided with a notch respectively. Each heat-dissipating plate overlaps with adjacent one heat-dissipating plate in a head-to-tail manner, so that the two notches of each heat-dissipating plate form an intake notch channel and an exhaust notch channel respectively. The dividing strips form an intersecting structure on upper and lower sides of each through-hole respectively to thereby define a multi-direction sub-channel. The cooling liquid flows from the intake notch channel into the multi-direction sub-channels and exits via the exhaust notch channel. In this way, the heat-exchanging efficiency and heat-dissipating effect are improved.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat sink, and in particular to a liquid-cooling heat sink and a heat exchanger thereof.[0003]2. Description of Prior Art[0004]With the rapid advancement of science and technology, the performance and power of electronic elements increase greatly, so that the amount of heat generated by the electronic elements also gets more and more. If the heat generated by the electronic elements is not dissipated to the outside, the heat will be accumulated in the electronic elements to cause the increase of their temperature. As a result, the performance of the electronic elements is deteriorated and thus their lifetime is shortened.[0005]Therefore, a heat sink is mounted in an electronic apparatus such as a computer host, a liquid crystal display, a television set, a plasma TV to dissipate its heat. At an early stage, a fan is often used as the heat sink. However, the heat-dissipating effect of t...

Claims

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Application Information

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IPC IPC(8): F28F9/00F28F7/00
CPCF28F3/086F28F3/12H01L23/473H01L2924/0002H01L2924/00
Inventor CHENG, CHIA-CHUN
Owner COOLER MASTER CO LTD
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